Bonding equipment · Hybrid bonding
BESI
Netherlands-listed bonding-equipment maker. Leader in hybrid bonding for next-gen HBM, with HBM4+ adoption expanding.
BESI.AS Updated 2026-06-20
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- Segments · Hybrid bonding
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- SK hynix Medium confidence
Next-gen hybrid bonding (HBM4+).Mentions EN TrendForce Published Dec 12, 2025: "TrendForce: BESI is expanding its hybrid-bonding share."Confirms KO ZDNet Korea Published Jul 25, 2025: "The hybrid-bonding market for next-gen HBM (HBM4+) is expanding, with BESI in the lead." - Samsung Electronics Medium confidence
Samsung is evaluating whether to adopt BESI's hybrid bonding.Confirms KO The Elec Published Apr 10, 2026: "A decision on Samsung adopting Netherlands-based BESI's hybrid bonding is expected soon."
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