# Who are BESI's customers? Who does BESI earn revenue from?
Canonical: https://valuechain.wiki/besi · Facet: customers · Updated: 2026-07-12T03:42:35.141415+00:00 · Source: ValueChain.wiki (cited money-flow graph)

**Citable summary**: BESI's confirmed revenue counterparties include TSMC, SK하이닉스, Intel plus 3 undisclosed/aggregate relationships. Per the valuechain.wiki graph: 6 revenue edges, backed by 7 dated sources, 2 of them primary filings (as of 2026-07-12).

### TSMC (mid)  → /tsmc.md
- metric: Revenue >$2B · 장기목표 · BESI long-term revenue target €1.5-1.9B
- note: Supplies hybrid-bonding and die-attach tools to TSMC advanced packaging (SoIC) — foundry stacking demand underpins BESI's long-term target (€1.5-1.9B).
- [confirms] BESI Investor Relations (EN, filing, published 2026-02-19) https://www.besi.com/news-investors/reports-presentations/: "BESI long-term revenue target €1.5-1.9B, expecting new AI customers."
- [confirms] Yole Group (EN, analysis, published 2025-08-01) https://www.yolegroup.com/press-release/advanced-packaging-fuels-transformation-in-back-end-equipment-tcb-and-hybrid-bonding-to-lead-1-3-billion-market-expansion-by-2030/: "BESI supplies hybrid-bonding tools to TSMC and others."

### SK하이닉스 (mid)  → /sk-hynix.md
- note: Candidate for next-gen HBM4+ hybrid bonding — as SK hynix shifts stacking from TCB to hybrid, BESI is first in line. Still pre-mass-adoption, so timing is the swing factor.
- [mentions] TrendForce (EN, news, published 2025-12-12) https://www.trendforce.com/news/2025/12/12/news-sk-hynix-reportedly-places-hbm4-tc-bonder-order-with-asmpt-as-hanmi-hanwha-patent-clash-heats-up/: "TrendForce: BESI is expanding its hybrid-bonding share."
- [confirms] ZDNet Korea (KO, news, published 2025-07-25) https://zdnet.co.kr/view/?no=20250725094205: "The hybrid-bonding market for next-gen HBM (HBM4+) is expanding, with BESI in the lead."

### Intel (mid)  → /intel.md
- note: Supplies hybrid-bonding and die-attach tools to Intel's Foveros 3D stacking — another axis of logic advanced-packaging adoption.
- [confirms] Yole Group (EN, analysis, published 2025-08-01) https://www.yolegroup.com/press-release/advanced-packaging-fuels-transformation-in-back-end-equipment-tcb-and-hybrid-bonding-to-lead-1-3-billion-market-expansion-by-2030/: "BESI customers include Intel (hybrid bonding)."

### ASE테크놀로지 (mid)  → /ase.md
- note: Supplies die-attach and hybrid-bonding tools to OSATs like ASE — the packaging-house adoption path beyond foundries; as OSATs move to hybrid, the demand base widens.
- [mentions] SEC EDGAR (EN, filing, published 2026-04-01) https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm: "ASE buys advanced-packaging tools."

### 앰코테크놀로지 (mid)  → /amkor.md
- note: Supplies die-attach and hybrid-bonding tools to OSATs like Amkor — with ASE, one of the two pillars of packaging-house adoption.
- [confirms] BESI Investor Relations (EN, filing, published 2026-02-19) https://www.besi.com/news-investors/reports-presentations/: "BESI annual report: supplies tools to OSATs (Amkor, ASE) and foundries."
- [mentions] Amkor Technology IR (EN, ir, accessed 2026-06-20) https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced: "Amkor is a customer buying back-end equipment and substrates."

### 삼성전자 (mid)  → /samsung-electronics.md
- note: Samsung is evaluating hybrid-bonding adoption — the decision is the step-change trigger for BESI's results and the most imminent event on this node.
- [confirms] TheElec (KO, news, published 2026-04-10) https://www.thelec.kr/news/articleView.html?idxno=56024: "A decision on Samsung adopting Netherlands-based BESI's hybrid bonding is expected soon."

Reverse side: https://valuechain.wiki/besi/suppliers.md · Ripple: https://valuechain.wiki/besi/ripple.md

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Full node: https://valuechain.wiki/besi.md · JSON: https://valuechain.wiki/besi.json