Custom AI ASIC · Networking · Infra software

Broadcom

Co-designs and co-develops custom AI chips such as Google’s TPU, alongside networking chips and VMware software. AI-semiconductor revenue is surging (Q2 FY2026 $10.8B, +143%; total revenue $22.2B). FY2026 AI revenue guidance raised to $56B. Chips are fabbed at TSMC; HBM from SK hynix, Samsung and Micron.

AVGO Updated 2026-06-20

Money in ▸Google●Revenue ~$10.8B Meta●Anthropic◐Apple◐

BroadcomInfra software $27B

▸ Money outTSMC●SK hynix●Samsung Electronics◐Micron Technology◐Samsung Electro-Mechanics◐

Financials & Segments

Total revenue · Infra software $27B (FY2025) + semiconductors. AI semis $10.8B/quarter (+143%, Q2 FY2026), FY2026 AI guidance $56B
Customer concentration · Top 5 customers 40%, one distributor 32% (FY2025)
Segments · Semiconductor Solutions · Infrastructure Software($27B)

Revenue from

Google High confidence· Revenue ~$10.8B · FY26 Q2 · AI-semi quarterly revenue (Google is the largest share)
Largest custom AI chip customer, co-designing the TPU (made by TSMC).
Confirms EN SEC EDGAR Published Jun 3, 2026: "Q2 FY2026 AI-semiconductor revenue of $10.8B (+143%), driven by custom AI accelerators and networking; FY2026 AI guidance $56B."
Confirms KO Seoul Economic Daily Published Mar 6, 2026: "Broadcom's AI chip revenue surges (Google and Meta custom chips)."
Confirms KO ZDNet Korea Published Nov 25, 2025: "Google opens its Broadcom co-designed AI chip (TPU) externally, spreading to Meta and Anthropic."
Meta High confidence
Adopts Google's TPU and develops its own AI chips with Broadcom.
Confirms KO Korea Economic Daily Published Nov 25, 2025: "Meta invests in Google's Tensor chip (TPU) as a GPU alternative."
Anthropic Medium confidence
Adopting Google's AI chip (TPU), adding to demand for Broadcom's custom silicon.
Mentions KO ZDNet Korea Published Nov 25, 2025: "Anthropic adopts Google's AI chip, accelerating the move beyond NVIDIA."
Apple Medium confidence
Supplies wireless and RF parts; Apple is one of Broadcom's largest customers.
Mentions EN SEC EDGAR Published Dec 18, 2025: "Broadcom 10-K: top 5 customers 40% (including Apple)."

Pays to

TSMC High confidence
Wafer foundry for TPU and custom AI chips; most front-end is outsourced.
Confirms EN SEC EDGAR Published Dec 18, 2025: "Broadcom 10-K: outsources the majority of front-end wafer manufacturing to external foundries including TSMC."
Confirms KO Digital Daily Published Dec 1, 2025: "TSMC manufactures the TPU co-designed by Google and Broadcom."
SK hynix High confidence
Buys HBM at large scale for custom AI accelerators.
Confirms KO ZDNet Korea Published Mar 5, 2026: "Broadcom's AI chip growth drives Samsung and SK HBM demand."
Confirms KO The Elec Published May 20, 2025: "SK hynix supplies HBM to Broadcom at large scale."
Samsung Electronics Medium confidence
HBM supplier for AI accelerators.
Confirms KO Seoul Economic Daily Published Mar 6, 2026: "Broadcom's AI revenue surge opens a door for Samsung HBM."
Micron Technology Medium confidence
HBM supplier for AI accelerators.
Mentions KO ZDNet Korea Published Mar 5, 2026: "Demand for Samsung, SK and Micron HBM expands with Broadcom's AI chips."
Samsung Electro-Mechanics Medium confidence
Sources advanced AI-accelerator FC-BGA from Samsung Electro-Mechanics from 2H 2026.
Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."

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