Back-end packaging and bonding equipment
ASMPT
Hong Kong-listed global back-end equipment maker. Newly won SK hynix HBM4 TC bonder orders, splitting volume with Hanmi.
0522.HK Updated 2026-06-20
Financials & Segments
- Segments · TCB/Packaging
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- SK hynix High confidence· Supply share ~50% · HBM4 2026 · SK HBM4 TC bonder orders
HBM4 TC bonder orders. About half of current order volume.Confirms EN TrendForce Published Dec 12, 2025: "TrendForce: SK hynix ordered HBM4 TC bonders from ASMPT, split with Hanmi."Confirms KO The Elec Published Sep 10, 2025: "SK hynix placed a new order with ASMPT for 7 HBM4 TC bonders (about ₩300B)." - Samsung Electronics Medium confidence
Supplies TC bonders for Samsung's HBM lines.
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