Semiconductors · Memory · Foundry

Samsung Electronics

A diversified semiconductor company spanning memory, foundry, and finished products. In the AI cycle it supplies HBM to AMD and NVIDIA and builds chips for Tesla, Apple, and Qualcomm through its foundry.

005930.KS Updated 2026-06-19

Money in ▸Tesla●Contract value $16BNVIDIA●AMD●Qualcomm◐Apple◐Marvell◐Broadcom◐Alphabet (Google)○
Samsung Electronics₩333.6T
▸ Money outASML●ASMPT◐Hanmi Semiconductor◐Hanwha Semitech◐BESI◐동진쎄미켐○심텍○LG이노텍○Samsung Electro-Mechanics○

Financials & Segments

  • Total revenue · ₩333.6T (FY2025 consolidated)
  • Operating profit · ₩43.6T
  • Net income · ₩45.2T
  • Segments · DS (Semiconductors) · DX · SDC · Harman

Revenue from

  • Tesla High confidence· Contract value $16B · multi-year
    Foundry (Taylor fab AI chip).
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."
    Confirms EN SEC EDGAR Published Jan 29, 2026: "Tesla 10-K: "a new collaboration with Samsung to manufacture advanced semiconductors for AI inference and training in the U.S." Buyer-side (Tesla) primary filing confirming Samsung to Tesla foundry ($16B)."
    Confirms EN TrendForce Published Nov 13, 2025: "Samsung and Tesla signed a $16B contract to make AI chips at the Taylor fab."
  • NVIDIA High confidence
    Began supplying HBM3E from Q3 2025.
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."
    Confirms EN SEC EDGAR Published Feb 26, 2026: "NVIDIA 10-K (FY2026): "We purchase memory from ... Samsung" and "We utilize foundries, such as TSMC and Samsung, to produce our semiconductor wafers." Confirms NVIDIA's Samsung memory purchases and foundry use."
    Confirms EN KED Global Published Oct 30, 2025: "After starting HBM shipments to NVIDIA in Q3, Samsung sold out its 2026 volume."
  • AMD High confidence
    Supplies 12-high HBM3E (MI350 accelerator); seen as ahead on HBM4.
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."
    Confirms EN SEC EDGAR Published Feb 4, 2026: "AMD 10-K: "we utilize TSMC, UMC and Samsung Electronics" (foundry). Buyer-side (AMD) primary filing confirming Samsung to AMD supply."
    Mentions EN KED Global Published Oct 30, 2025: "Samsung built an HBM partnership with AMD."
  • Qualcomm Medium confidence
    Foundry contract manufacturing (Austin fab).
    Mentions EN TrendForce Published Nov 13, 2025: "Qualcomm added to the Austin fab's customers."
  • Apple Medium confidence
    Foundry contract manufacturing.
    Mentions EN TrendForce Published Nov 13, 2025: "In 2025 Samsung secured foundry contracts with major North American firms including Tesla and Apple."
  • Marvell Medium confidence
    Custom HBM collaboration for Marvell's custom AI chips.
    Confirms KO Korea Economic Daily Published Dec 11, 2024: "Marvell works with Samsung and SK hynix on custom HBM."
  • Broadcom Medium confidence
    Supplies HBM for Broadcom's AI accelerators.
    Confirms KO Seoul Economic Daily Published Mar 6, 2026: "Broadcom's AI revenue surge opens a door for Samsung HBM."
  • Alphabet (Google) Low confidence
    Under consideration to make some next-gen Google TPU (Icefish) components at its foundry (not confirmed).
    Mentions KO THE ELEC Accessed Jun 20, 2026: "Google is considering Samsung’s foundry for some next-gen TPU components."

Pays to

  • ASML High confidence
    Buys EUV lithography from ASML (its largest customer).
    Confirms EN Seoul Economic Daily Published Apr 17, 2026: "Samsung and SK secured two-thirds of ASML's 2025 EUV shipments (~40 units, $14B)."
  • ASMPT Medium confidence
    HBM TC bonder.
  • Hanmi Semiconductor Medium confidence
    HBM bonding equipment (TC bonder). Shares this supplier with SK hynix.
  • Hanwha Semitech Medium confidence
    HBM TC bonder.
  • BESI Medium confidence
    HBM bonder.
  • 동진쎄미켐 Low confidence
    Semiconductor materials (photoresist, etc.). Supply relationship inferred.
    Mentions EN Blackridge Research Accessed Jun 19, 2026: "Korean materials and packaging suppliers such as Dongjin Semichem."
  • 심텍 Low confidence
    Package substrates. Supply relationship inferred.
    Mentions EN Blackridge Research Accessed Jun 19, 2026: "Substrate suppliers such as Simmtech."
  • LG이노텍 Low confidence
    Substrates and components. Supply relationship inferred.
    Mentions EN Blackridge Research Accessed Jun 19, 2026: "Components and substrates from suppliers such as LG Innotek."
  • Samsung Electro-Mechanics Low confidence
    MLCC, substrates and other components (affiliate).
    Mentions EN Blackridge Research Accessed Jun 19, 2026: "Component affiliates such as Samsung Electro-Mechanics."

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