Back-end semiconductor equipment · HBM TC bonder
Hanmi Semiconductor
A core HBM back-end equipment maker. Primary TC bonder supplier to SK hynix with a long series of single-supply contracts. Competes with ASMPT and Hanwha Semitech on HBM4 share.
042700.KS Updated 2026-06-20
Hanmi Semiconductor₩576.7B
▸ Money out부품·모듈 공급사 (Bonder Modules 外)◐Purchases ₩153.2B외주 임가공 협력사◐Purchases ₩28.2B
Financials & Segments
- Total revenue · ₩576.7B (FY2025 consolidated)
- Operating profit · ₩251.4B
- Net income · ₩214B
- Segments · HBM TC bonder
Revenue from
- SK hynix High confidence· Contract value ₩44.2B · 2026-06-08 · Single-supply contract (latest)
HBM TC bonder single-supply contract series (DART primary): ₩42.8B (May'25) → ₩1.6B (Nov'25) → ₩9.7B (Jan'26) → ₩44.2B (Jun'26).Confirms KO DART (FSS Electronic Disclosure) Published Jun 8, 2026: "Hanmi DART single-supply contract: SK hynix, ₩44.2B, contract date 2026-06-08."Confirms KO DART (FSS Electronic Disclosure) Published Jan 14, 2026: "Hanmi DART single-supply contract: SK hynix, ₩9.65B, contract date 2026-01-14."Confirms KO DART (FSS Electronic Disclosure) Published Nov 14, 2025: "Hanmi DART single-supply contract: SK hynix, ₩1.57B, contract date 2025-11-14."Confirms KO DART (FSS Electronic Disclosure) Published May 16, 2025: "Hanmi DART single-supply contract: SK hynix, ₩42.81B, contract date 2025-05-16."Confirms EN The Elec Accessed Jun 19, 2026: "The Elec: report on Hanmi supplying HBM TC bonders to SK hynix." - ASE (대만) High confidence· Contract value ₩8B · 2025-05-27 · Single-supply contract (Taiwan ASE)
TC bonder supply. Single-supply contract with Taiwan OSAT ASE (DART primary). ₩8.05B, 2025-05-27.Confirms KO DART (FSS Electronic Disclosure) Published May 28, 2025: "Hanmi DART: counterparty ASE (Taiwan), ₩8.05B, contract date 2025-05-27." - Samsung Electronics Medium confidence
Supplies HBM TC bonders to Samsung (shared supplier with SK hynix).
Pays to
- 부품·모듈 공급사 (Bonder Modules 外) Medium confidence· Purchases ₩153.2B · FY2025 · Raw materials (bonder modules and equipment parts)
Buys parts and modules for TC bonder manufacturing. 84.46% of raw-material purchases. The filing discloses items and amounts but not supplier names.Confirms KO DART (FSS Electronic Disclosure) Published Mar 12, 2026: "Hanmi business report: main raw material 'bonder modules and equipment parts' purchases of ₩153,159M (84.46%). Supplier names not disclosed." - 외주 임가공 협력사 Medium confidence· Purchases ₩28.2B · FY2025 · Subcontract processing
Subcontract assembly and processing. 15.54% of raw-material purchases. Supplier not disclosed.Confirms KO DART (FSS Electronic Disclosure) Published Mar 12, 2026: "Hanmi business report: subcontract processing of ₩28,171M (15.54%). Partner names not disclosed."