{"slug":"samsung-electronics","name":"삼성전자","name_en":"Samsung Electronics","ticker":"005930.KS","updated_at":"2026-06-19","canonical":"https://valuechain.wiki/samsung-electronics","kicker":"반도체 · 메모리 · 파운드리","kicker_en":"Semiconductors · Memory · Foundry","lead":"메모리·파운드리·세트를 아우르는 종합 반도체 기업. AI 사이클에서는 HBM을 AMD·NVIDIA에 공급하고, 파운드리로 Tesla·Apple·Qualcomm의 칩을 위탁생산한다.","lead_en":"A diversified semiconductor company spanning memory, foundry, and finished products. In the AI cycle it supplies HBM to AMD and NVIDIA and builds chips for Tesla, Apple, and Qualcomm through its foundry.","segments":{"fy":2025,"parts":[{"desc":"메모리(DRAM·NAND·HBM)·파운드리·시스템LSI (HBM/파운드리 엣지의 출처 부문)","name":"DS(반도체)"},{"desc":"모바일(MX)·영상가전·생활가전","name":"DX"},{"desc":"디스플레이(삼성디스플레이)","name":"SDC"},{"desc":"전장·오디오","name":"Harman"}],"total":"333.6조원 (FY2025 연결)","source":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","total_krw":333605938000000,"fin_source":"OpenDART fnlttSinglAcntAll 2025 CFS","op_profit_krw":43601051000000,"net_income_krw":45206805000000},"segments_en":{"parts":[{"desc":"Memory (DRAM, NAND, HBM), foundry, System LSI (the segment behind the HBM/foundry edges)","name":"DS (Semiconductors)"},{"desc":"Mobile (MX), visual display, home appliances","name":"DX"},{"desc":"Displays (Samsung Display)","name":"SDC"},{"desc":"Automotive electronics and audio","name":"Harman"}],"total":"₩333.6T (FY2025 consolidated)"},"edges":[{"direction":"revenue","counterparty":"Tesla","counterparty_slug":null,"confidence":"high","metric":{"type":"contract_value","unit":"USD","as_of":"2025-11-13","value":16000000000,"period":"multi_year","qualifier":"exact"},"note":"파운드리(Taylor팹 AI칩).","note_en":"Foundry (Taylor fab AI chip).","sources":[{"stance":"mentions","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-10","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","title":"삼성전자 사업보고서 (2025.12)","title_en":"Samsung Electronics business report (2025.12)","excerpt":"삼성전자 사업보고서: 해당 매출은 DS(반도체)/파운드리 부문에서 발생. FY2025 연결 매출 333.6조, 영업이익 43.6조. 사업보고서는 개별 고객명을 공개하지 않음(부문 단위).","excerpt_en":"Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":null,"kind":"filing","lang":"en","published_at":"2026-01-29","url":"https://www.sec.gov/Archives/edgar/data/1318605/000162828026003952/tsla-20251231.htm","title":"Tesla Form 10-K (2026-01-29)","title_en":null,"excerpt":"Tesla 10-K: \"a new collaboration with Samsung to manufacture advanced semiconductors for AI inference and training in the U.S.\" 삼성→Tesla 파운드리($16B)를 매입자(Tesla) 측 1차 공시로 확인.","excerpt_en":"Tesla 10-K: \"a new collaboration with Samsung to manufacture advanced semiconductors for AI inference and training in the U.S.\" Buyer-side (Tesla) primary filing confirming Samsung to Tesla foundry ($16B)."},{"stance":"confirms","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-11-13","url":"https://www.trendforce.com/news/2025/11/13/news-samsung-reportedly-eyes-foundry-profitability-by-2027-with-20-market-share/","title":"Samsung eyes foundry profitability by 2027","title_en":null,"excerpt":"삼성-Tesla, Taylor팹 AI칩 위탁생산 $16B 계약.","excerpt_en":"Samsung and Tesla signed a $16B contract to make AI chips at the Taylor fab."}]},{"direction":"revenue","counterparty":"NVIDIA","counterparty_slug":"nvidia","confidence":"high","metric":{"type":"supply_relationship","unit":null,"basis":"HBM3E 공급(NVIDIA 10-K 매입 확인)","period":"2025-2026","basis_en":"HBM3E supply (confirmed in NVIDIA 10-K)","qualifier":"confirmed_no_disclosed_value"},"note":"HBM3E를 2025 3분기부터 공급 개시.","note_en":"Began supplying HBM3E from Q3 2025.","sources":[{"stance":"mentions","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-10","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","title":"삼성전자 사업보고서 (2025.12)","title_en":"Samsung Electronics business report (2025.12)","excerpt":"삼성전자 사업보고서: 해당 매출은 DS(반도체)/파운드리 부문에서 발생. FY2025 연결 매출 333.6조, 영업이익 43.6조. 사업보고서는 개별 고객명을 공개하지 않음(부문 단위).","excerpt_en":"Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":null,"kind":"filing","lang":"en","published_at":"2026-02-26","url":"https://www.sec.gov/Archives/edgar/data/1045810/000104581026000021/nvda-20260125.htm","title":"NVIDIA Form 10-K (FY2026, 2026-01-25)","title_en":null,"excerpt":"NVIDIA 10-K(FY2026): \"We purchase memory from ... Samsung\" 및 \"We utilize foundries, such as TSMC and Samsung, to produce our semiconductor wafers.\" — NVIDIA의 삼성 메모리 매입 + 삼성 파운드리 이용 확인.","excerpt_en":"NVIDIA 10-K (FY2026): \"We purchase memory from ... Samsung\" and \"We utilize foundries, such as TSMC and Samsung, to produce our semiconductor wafers.\" Confirms NVIDIA's Samsung memory purchases and foundry use."},{"stance":"confirms","publisher":"KED Global","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-10-30","url":"https://www.kedglobal.com/earnings/newsView/ked202510300005","title":"Samsung sells out 2026 HBM after Nvidia shipments","title_en":null,"excerpt":"삼성이 3분기 NVIDIA향 HBM 출하 시작 후 2026 물량 완판.","excerpt_en":"After starting HBM shipments to NVIDIA in Q3, Samsung sold out its 2026 volume."}]},{"direction":"revenue","counterparty":"AMD","counterparty_slug":"amd","confidence":"high","metric":{"type":"supply_relationship","basis":"파운드리(AMD 10-K: utilize Samsung) + HBM","period":"2025-2026","basis_en":"Foundry (AMD 10-K: utilize Samsung) + HBM","qualifier":"confirmed_no_disclosed_value"},"note":"HBM3E 12단(MI350 가속기) 공급, HBM4 우위 평가.","note_en":"Supplies 12-high HBM3E (MI350 accelerator); seen as ahead on HBM4.","sources":[{"stance":"mentions","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-10","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","title":"삼성전자 사업보고서 (2025.12)","title_en":"Samsung Electronics business report (2025.12)","excerpt":"삼성전자 사업보고서: 해당 매출은 DS(반도체)/파운드리 부문에서 발생. FY2025 연결 매출 333.6조, 영업이익 43.6조. 사업보고서는 개별 고객명을 공개하지 않음(부문 단위).","excerpt_en":"Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-04","url":"https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm","title":"AMD Form 10-K (FY2025, 2025-12-27)","title_en":"AMD Form 10-K (FY2025, 2025-12-27)","excerpt":"AMD 10-K: \"we utilize TSMC, UMC and Samsung Electronics\" (파운드리). 삼성→AMD 공급을 매입자(AMD) 측 1차 공시로 확인.","excerpt_en":"AMD 10-K: \"we utilize TSMC, UMC and Samsung Electronics\" (foundry). Buyer-side (AMD) primary filing confirming Samsung to AMD supply."},{"stance":"mentions","publisher":"KED Global","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-10-30","url":"https://www.kedglobal.com/earnings/newsView/ked202510300005","title":"Samsung sells out 2026 HBM after Nvidia shipments","title_en":null,"excerpt":"삼성이 AMD와 HBM 파트너십 구축.","excerpt_en":"Samsung built an HBM partnership with AMD."}]},{"direction":"cost","counterparty":"ASML","counterparty_slug":"asml","confidence":"high","metric":null,"note":"EUV 노광장비를 ASML에서 매입(최대 고객).","note_en":"Buys EUV lithography from ASML (its largest customer).","sources":[{"stance":"confirms","publisher":"Seoul Economic Daily","publisher_en":"Seoul Economic Daily","kind":"news","lang":"en","published_at":"2026-04-17","url":"https://en.sedaily.com/finance/2026/04/17/samsung-sk-secure-two-thirds-of-asmls-annual-euv-shipments","title":"Samsung, SK Secure Two-Thirds of ASML's Annual EUV Shipments","title_en":"Samsung, SK Secure Two-Thirds of ASML's Annual EUV Shipments","excerpt":"삼성·SK가 2025 ASML EUV 출하의 2/3(약 40대, $14B 투자) 확보.","excerpt_en":"Samsung and SK secured two-thirds of ASML's 2025 EUV shipments (~40 units, $14B)."}]},{"direction":"revenue","counterparty":"Qualcomm","counterparty_slug":null,"confidence":"mid","metric":null,"note":"파운드리 위탁생산(오스틴팹).","note_en":"Foundry contract manufacturing (Austin fab).","sources":[{"stance":"mentions","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-11-13","url":"https://www.trendforce.com/news/2025/11/13/news-samsung-reportedly-eyes-foundry-profitability-by-2027-with-20-market-share/","title":"Samsung eyes foundry profitability by 2027","title_en":null,"excerpt":"오스틴팹 고객에 Qualcomm 추가.","excerpt_en":"Qualcomm added to the Austin fab's customers."}]},{"direction":"cost","counterparty":"ASMPT","counterparty_slug":"asmpt","confidence":"mid","metric":null,"note":"HBM TC본더.","note_en":"HBM TC bonder.","sources":[]},{"direction":"cost","counterparty":"한미반도체","counterparty_slug":"hanmi-semiconductor","confidence":"mid","metric":null,"note":"HBM 본딩 장비(TC본더). SK하이닉스와 공급사 공유.","note_en":"HBM bonding equipment (TC bonder). Shares this supplier with SK hynix.","sources":[]},{"direction":"cost","counterparty":"한화세미텍","counterparty_slug":"hanwha-semitech","confidence":"mid","metric":null,"note":"HBM TC본더.","note_en":"HBM TC bonder.","sources":[]},{"direction":"cost","counterparty":"BESI","counterparty_slug":"besi","confidence":"mid","metric":null,"note":"HBM 본더.","note_en":"HBM bonder.","sources":[]},{"direction":"revenue","counterparty":"Apple","counterparty_slug":"apple","confidence":"mid","metric":null,"note":"파운드리 위탁생산.","note_en":"Foundry contract manufacturing.","sources":[{"stance":"mentions","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-11-13","url":"https://www.trendforce.com/news/2025/11/13/news-samsung-reportedly-eyes-foundry-profitability-by-2027-with-20-market-share/","title":"Samsung eyes foundry profitability by 2027","title_en":null,"excerpt":"2025년 삼성이 Tesla·Apple 등 북미 대형사 파운드리 계약 확보.","excerpt_en":"In 2025 Samsung secured foundry contracts with major North American firms including Tesla and Apple."}]},{"direction":"revenue","counterparty":"Marvell","counterparty_slug":"marvell","confidence":"mid","metric":null,"note":"마벨 커스텀 AI칩용 맞춤형 HBM 협력.","note_en":"Custom HBM collaboration for Marvell's custom AI chips.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2024-12-11","url":"https://www.hankyung.com/article/202412110524i","title":"美 마벨, 삼성·SK하이닉스와 협력…맞춤형 HBM 탑재","title_en":"Marvell partners with Samsung and SK hynix on custom HBM","excerpt":"마벨이 삼성·SK하이닉스와 맞춤형 HBM 협력.","excerpt_en":"Marvell works with Samsung and SK hynix on custom HBM."}]},{"direction":"revenue","counterparty":"Broadcom","counterparty_slug":"broadcom","confidence":"mid","metric":null,"note":"브로드컴 AI 가속기용 HBM 공급사.","note_en":"Supplies HBM for Broadcom's AI accelerators.","sources":[{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2026-03-06","url":"https://www.sedaily.com/article/14157561","title":"브로드컴 실적 뜯어보니…AI 매출 급증, 삼성 HBM '역전의 문'","title_en":"Broadcom results: AI revenue surges, opening a door for Samsung HBM","excerpt":"브로드컴 AI 매출 급증이 삼성 HBM '역전의 문'을 연다.","excerpt_en":"Broadcom's AI revenue surge opens a door for Samsung HBM."}]},{"direction":"cost","counterparty":"동진쎄미켐","counterparty_slug":null,"confidence":"low","metric":null,"note":"반도체 소재(포토레지스트 등). 공급관계 추정.","note_en":"Semiconductor materials (photoresist, etc.). Supply relationship inferred.","sources":[{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"동진쎄미켐 등 한국 소재/패키징 공급사.","excerpt_en":"Korean materials and packaging suppliers such as Dongjin Semichem."}]},{"direction":"cost","counterparty":"심텍","counterparty_slug":null,"confidence":"low","metric":null,"note":"패키지 기판. 공급관계 추정.","note_en":"Package substrates. Supply relationship inferred.","sources":[{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"심텍 등 기판 공급사.","excerpt_en":"Substrate suppliers such as Simmtech."}]},{"direction":"cost","counterparty":"LG이노텍","counterparty_slug":null,"confidence":"low","metric":null,"note":"기판·부품. 공급관계 추정.","note_en":"Substrates and components. Supply relationship inferred.","sources":[{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"LG이노텍 등 부품/기판.","excerpt_en":"Components and substrates from suppliers such as LG Innotek."}]},{"direction":"cost","counterparty":"삼성전기","counterparty_slug":"samsung-electro-mechanics","confidence":"low","metric":null,"note":"MLCC·기판 등 부품(계열).","note_en":"MLCC, substrates and other components (affiliate).","sources":[{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"삼성전기 등 부품 계열사.","excerpt_en":"Component affiliates such as Samsung Electro-Mechanics."}]},{"direction":"revenue","counterparty":"Alphabet (Google)","counterparty_slug":"alphabet","confidence":"low","metric":null,"note":"구글 차세대 TPU(아이스피시) 일부 부품 생산을 파운드리에서 검토 중(미확정).","note_en":"Under consideration to make some next-gen Google TPU (Icefish) components at its foundry (not confirmed).","sources":[{"stance":"mentions","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":null,"url":"https://www.thelec.kr/news/articleView.html?idxno=58018","title":"구글 차세대 TPU, 삼성도 만든다","title_en":"Samsung to make some of Google’s next-gen TPU","excerpt":"구글이 차세대 TPU 핵심 부품 생산을 삼성 파운드리에 검토.","excerpt_en":"Google is considering Samsung’s foundry for some next-gen TPU components."}]}]}