{"slug":"broadcom","name":"Broadcom","name_en":"Broadcom","ticker":"AVGO","updated_at":"2026-06-20","canonical":"https://valuechain.wiki/broadcom","kicker":"커스텀 AI ASIC · 네트워킹 · 인프라SW","kicker_en":"Custom AI ASIC · Networking · Infra software","lead":"구글 TPU 등 커스텀 AI 칩을 공동설계·위탁개발하고 네트워킹 칩과 VMware 소프트웨어를 함께 한다. AI 반도체 매출 급증(FY26 Q2 분기 $10.8B, +143%, 총매출 $22.2B). FY2026 AI 매출 가이던스 $56B로 상향. 칩은 TSMC에 위탁, HBM은 SK·삼성·마이크론에서 매입.","lead_en":"Co-designs and co-develops custom AI chips such as Google’s TPU, alongside networking chips and VMware software. AI-semiconductor revenue is surging (Q2 FY2026 $10.8B, +143%; total revenue $22.2B). FY2026 AI revenue guidance raised to $56B. Chips are fabbed at TSMC; HBM from SK hynix, Samsung and Micron.","segments":{"fy":2025,"parts":[{"desc":"커스텀 AI ASIC·네트워킹·무선·스토리지","name":"반도체 솔루션"},{"desc":"VMware·메인프레임·보안","name":"인프라 소프트웨어","share":"$27B"}],"total":"인프라SW $27B (FY2025) + 반도체. AI 반도체 분기 $10.8B(+143%, FY26 Q2), FY2026 AI 가이던스 $56B","source":"https://www.sec.gov/Archives/edgar/data/1730168/000173016826000051/avgo-05032026x8kxex99.htm","concentration":"상위 5고객 40%, 유통 1곳 32% (FY2025)"},"segments_en":{"parts":[{"desc":"Custom AI ASIC, networking, wireless, storage","name":"Semiconductor Solutions"},{"desc":"VMware, mainframe, security","name":"Infrastructure Software","share":"$27B"}],"total":"Infra software $27B (FY2025) + semiconductors. AI semis $10.8B/quarter (+143%, Q2 FY2026), FY2026 AI guidance $56B","concentration":"Top 5 customers 40%, one distributor 32% (FY2025)"},"edges":[{"direction":"revenue","counterparty":"Google","counterparty_slug":"alphabet","confidence":"high","metric":{"type":"revenue_amount","unit":"USD","as_of":"2026-05-03","basis":"AI 반도체 분기 매출(구글이 최대 비중)","value":10800000000,"period":"FY26 Q2","basis_en":"AI-semi quarterly revenue (Google is the largest share)","qualifier":"approx"},"note":"TPU를 공동설계·위탁개발하는 최대 커스텀 AI 칩 고객. TSMC가 생산.","note_en":"Largest custom AI chip customer, co-designing the TPU (made by TSMC).","sources":[{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-06-03","url":"https://www.sec.gov/Archives/edgar/data/1730168/000173016826000051/avgo-05032026x8kxex99.htm","title":"Broadcom 2026 회계연도 2분기 실적 (2026-05-03 종료)","title_en":"Broadcom Q2 FY2026 results (quarter ended May 3, 2026)","excerpt":"FY26 2분기 AI 반도체 매출 $10.8B(+143%), 커스텀 AI 가속기·네트워킹 수요가 견인. FY2026 AI 가이던스 $56B.","excerpt_en":"Q2 FY2026 AI-semiconductor revenue of $10.8B (+143%), driven by custom AI accelerators and networking; FY2026 AI guidance $56B."},{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2026-03-06","url":"https://www.sedaily.com/article/14157561","title":"브로드컴 실적 뜯어보니…AI 매출 급증, 삼성 HBM '역전의 문'","title_en":"Broadcom results: AI revenue surges, opening a door for Samsung HBM","excerpt":"브로드컴 AI 반도체 매출 급증(구글·메타 커스텀칩).","excerpt_en":"Broadcom's AI chip revenue surges (Google and Meta custom chips)."},{"stance":"confirms","publisher":"ZDNet Korea","publisher_en":"ZDNet Korea","kind":"news","lang":"ko","published_at":"2025-11-25","url":"https://zdnet.co.kr/view/?no=20251125180226","title":"구글, 자체 AI 칩 외부 개방…메타·앤트로픽과 '탈 엔비디아' 가속","title_en":"Google opens its AI chip externally, accelerating 'beyond NVIDIA' with Meta and Anthropic","excerpt":"구글이 브로드컴과 공동설계한 자체 AI칩(TPU)을 외부 개방, 메타·앤트로픽으로 확산.","excerpt_en":"Google opens its Broadcom co-designed AI chip (TPU) externally, spreading to Meta and Anthropic."}]},{"direction":"cost","counterparty":"TSMC","counterparty_slug":"tsmc","confidence":"high","metric":{"type":"supply_status","basis":"파운드리","basis_en":"foundry","qualifier":"confirmed_no_disclosed_value"},"note":"TPU·커스텀 AI칩 웨이퍼 파운드리. 전공정 대부분 외주.","note_en":"Wafer foundry for TPU and custom AI chips; most front-end is outsourced.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-12-18","url":"https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm","title":"Broadcom Form 10-K (FY2025, 2025-11-02)","title_en":"Broadcom Form 10-K (FY2025, 2025-11-02)","excerpt":"Broadcom 10-K: 전공정 웨이퍼 대부분을 TSMC 등 외부 파운드리에 위탁.","excerpt_en":"Broadcom 10-K: outsources the majority of front-end wafer manufacturing to external foundries including TSMC."},{"stance":"confirms","publisher":"디지털데일리","publisher_en":"Digital Daily","kind":"news","lang":"ko","published_at":"2025-12-01","url":"https://m.ddaily.co.kr/page/view/2025120111290617700","title":"엔비디아 대항마 된 구글 TPU, 삼성이 웃는 이유는","title_en":"Why Samsung smiles as Google's TPU becomes an NVIDIA rival","excerpt":"구글과 브로드컴이 공동설계한 TPU를 TSMC가 생산.","excerpt_en":"TSMC manufactures the TPU co-designed by Google and Broadcom."}]},{"direction":"cost","counterparty":"SK하이닉스","counterparty_slug":"sk-hynix","confidence":"high","metric":{"type":"supply_status","basis":"HBM 매입","basis_en":"HBM purchase","qualifier":"confirmed_no_disclosed_value"},"note":"커스텀 AI 가속기용 HBM 대규모 매입.","note_en":"Buys HBM at large scale for custom AI accelerators.","sources":[{"stance":"confirms","publisher":"ZDNet Korea","publisher_en":"ZDNet Korea","kind":"news","lang":"ko","published_at":"2026-03-05","url":"https://zdnet.co.kr/view/?no=20260305121446","title":"브로드컴, AI칩 고성장 자신…삼성·SK 메모리 수요 견인","title_en":"Broadcom confident in AI chip growth, driving Samsung/SK memory demand","excerpt":"브로드컴 AI칩 성장이 삼성·SK HBM 수요를 견인.","excerpt_en":"Broadcom's AI chip growth drives Samsung and SK HBM demand."},{"stance":"confirms","publisher":"디일렉","publisher_en":"The Elec","kind":"news","lang":"ko","published_at":"2025-05-20","url":"https://www.thelec.kr/news/articleView.html?idxno=31843","title":"SK하이닉스, 브로드컴에 HBM 대규모 공급","title_en":"SK hynix supplies HBM to Broadcom at large scale","excerpt":"SK하이닉스가 브로드컴에 HBM을 대규모 공급.","excerpt_en":"SK hynix supplies HBM to Broadcom at large scale."}]},{"direction":"revenue","counterparty":"Meta","counterparty_slug":"meta","confidence":"high","metric":null,"note":"구글 TPU 채택 + 자체 AI칩을 브로드컴과 개발.","note_en":"Adopts Google's TPU and develops its own AI chips with Broadcom.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2025-11-25","url":"https://www.hankyung.com/article/202511255235i","title":"메타도 구글 텐서칩 투자…텐서칩, GPU 대항마 될까?","title_en":"Meta also invests in Google's Tensor chip; can it rival the GPU?","excerpt":"메타가 구글 텐서칩(TPU)에 투자, GPU 대항마로.","excerpt_en":"Meta invests in Google's Tensor chip (TPU) as a GPU alternative."}]},{"direction":"revenue","counterparty":"Anthropic","counterparty_slug":null,"confidence":"mid","metric":null,"note":"구글 AI칩(TPU) 채택으로 브로드컴 커스텀칩 수요에 기여.","note_en":"Adopting Google's AI chip (TPU), adding to demand for Broadcom's custom silicon.","sources":[{"stance":"mentions","publisher":"ZDNet Korea","publisher_en":"ZDNet Korea","kind":"news","lang":"ko","published_at":"2025-11-25","url":"https://zdnet.co.kr/view/?no=20251125180226","title":"구글, 자체 AI 칩 외부 개방…메타·앤트로픽과 '탈 엔비디아' 가속","title_en":"Google opens its AI chip externally, accelerating 'beyond NVIDIA' with Meta and Anthropic","excerpt":"앤트로픽이 구글 AI칩 채택, 탈 엔비디아 가속.","excerpt_en":"Anthropic adopts Google's AI chip, accelerating the move beyond NVIDIA."}]},{"direction":"cost","counterparty":"삼성전자","counterparty_slug":"samsung-electronics","confidence":"mid","metric":null,"note":"AI 가속기용 HBM 공급사.","note_en":"HBM supplier for AI accelerators.","sources":[{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2026-03-06","url":"https://www.sedaily.com/article/14157561","title":"브로드컴 실적 뜯어보니…AI 매출 급증, 삼성 HBM '역전의 문'","title_en":"Broadcom results: AI revenue surges, opening a door for Samsung HBM","excerpt":"브로드컴 AI 매출 급증이 삼성 HBM '역전의 문'을 연다.","excerpt_en":"Broadcom's AI revenue surge opens a door for Samsung HBM."}]},{"direction":"cost","counterparty":"Micron Technology","counterparty_slug":"micron","confidence":"mid","metric":null,"note":"AI 가속기용 HBM 공급사.","note_en":"HBM supplier for AI accelerators.","sources":[{"stance":"mentions","publisher":"ZDNet Korea","publisher_en":"ZDNet Korea","kind":"news","lang":"ko","published_at":"2026-03-05","url":"https://zdnet.co.kr/view/?no=20260305121446","title":"브로드컴, AI칩 고성장 자신…삼성·SK 메모리 수요 견인","title_en":"Broadcom confident in AI chip growth, driving Samsung/SK memory demand","excerpt":"삼성·SK·마이크론 HBM 수요가 브로드컴 AI칩으로 확대.","excerpt_en":"Demand for Samsung, SK and Micron HBM expands with Broadcom's AI chips."}]},{"direction":"revenue","counterparty":"Apple","counterparty_slug":"apple","confidence":"mid","metric":null,"note":"무선·RF 부품 공급. Apple은 브로드컴 최대 고객 중 하나.","note_en":"Supplies wireless and RF parts; Apple is one of Broadcom's largest customers.","sources":[{"stance":"mentions","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-12-18","url":"https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm","title":"Broadcom Form 10-K (FY2025, 2025-11-02)","title_en":"Broadcom Form 10-K (FY2025, 2025-11-02)","excerpt":"Broadcom 10-K: 상위 5고객 40%(애플 등).","excerpt_en":"Broadcom 10-K: top 5 customers 40% (including Apple)."}]},{"direction":"cost","counterparty":"Samsung Electro-Mechanics","counterparty_slug":"samsung-electro-mechanics","confidence":"mid","metric":null,"note":"2026 하반기부터 AI 가속기용 FC-BGA를 삼성전기에서 신규 공급받음.","note_en":"Sources advanced AI-accelerator FC-BGA from Samsung Electro-Mechanics from 2H 2026.","sources":[{"stance":"mentions","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-10","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310003071","title":"삼성전기 사업보고서 (2025.12)","title_en":"Samsung Electro-Mechanics business report (2025.12)","excerpt":"삼성전기 사업보고서: 패키지솔루션(FC-BGA)·컴포넌트(MLCC) 부문. FY2025 매출 11.3조.","excerpt_en":"Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."},{"stance":"confirms","publisher":"디일렉","publisher_en":"The Elec","kind":"news","lang":"ko","published_at":"2026-01-31","url":"https://www.thelec.kr/news/articleView.html?idxno=51302","title":"삼성전기, MLCC·AI 서버용 기판 수요 급증…\"올해도 수급 빡빡\"","title_en":"Samsung Electro-Mechanics: surging demand for MLCC and AI-server substrates","excerpt":"삼성전기가 NVIDIA·AMD·구글·아마존·애플에 이어 브로드컴까지 FC-BGA 고객으로 확보, AI 가속기 기판 공급.","excerpt_en":"Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."}]}]}