{"slug":"hanmi-semiconductor","name":"한미반도체","name_en":"Hanmi Semiconductor","ticker":"042700.KS","updated_at":"2026-06-20","canonical":"https://valuechain.wiki/hanmi-semiconductor","kicker":"반도체 후공정 장비 · HBM TC본더","kicker_en":"Back-end semiconductor equipment · HBM TC bonder","lead":"HBM 후공정 핵심 장비사. SK하이닉스에 TC본더를 주력 공급하며 단일판매·공급계약 시계열 다수. HBM4에서 ASMPT·한화세미텍과 점유 경쟁.","lead_en":"A core HBM back-end equipment maker. Primary TC bonder supplier to SK hynix with a long series of single-supply contracts. Competes with ASMPT and Hanwha Semitech on HBM4 share.","segments":{"fy":2025,"note":"코스피 042700. HBM 후공정 핵심 장비사. SK하이닉스 TC본더 주력 공급.","parts":[{"desc":"TSV-TC Bonder, 듀얼 TC본더","name":"HBM TC본더"}],"total":"5,767억원 (FY2025 연결)","total_krw":576684619527,"fin_source":"OpenDART fnlttSinglAcntAll 2025 CFS/CIS","op_profit_krw":251390142142,"net_income_krw":214007548411},"segments_en":{"parts":[{"desc":"TSV-TC Bonder, dual TC bonder","name":"HBM TC bonder"}],"total":"₩576.7B (FY2025 consolidated)"},"edges":[{"direction":"revenue","counterparty":"SK하이닉스","counterparty_slug":"sk-hynix","confidence":"high","metric":{"type":"contract_value","unit":"KRW","as_of":"2026-06-08","basis":"단일판매ㆍ공급계약(최신)","value":44200000000,"period":"2026-06-08","basis_en":"Single-supply contract (latest)","qualifier":"latest_of_series"},"note":"HBM TC본더 단일판매ㆍ공급계약 시계열(DART 1차). 428억(25-05)→15.7억(25-11)→96.5억(26-01)→442억(26-06).","note_en":"HBM TC bonder single-supply contract series (DART primary): ₩42.8B (May'25) → ₩1.6B (Nov'25) → ₩9.7B (Jan'26) → ₩44.2B (Jun'26).","sources":[{"stance":"confirms","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-06-08","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260608800436","title":"한미반도체 단일판매·공급계약체결 (SK하이닉스, 442억원)","title_en":"Hanmi single-supply contract (SK hynix, ₩44.2B)","excerpt":"한미반도체 DART 단일판매ㆍ공급계약: SK하이닉스, 442.0억원, 계약일 2026-06-08.","excerpt_en":"Hanmi DART single-supply contract: SK hynix, ₩44.2B, contract date 2026-06-08."},{"stance":"confirms","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-01-14","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260114800028","title":"한미반도체 단일판매·공급계약체결 (SK하이닉스, 97억원)","title_en":"Hanmi single-supply contract (SK hynix, ₩9.7B)","excerpt":"한미반도체 DART 단일판매ㆍ공급계약: SK하이닉스, 96.5억원, 계약일 2026-01-14.","excerpt_en":"Hanmi DART single-supply contract: SK hynix, ₩9.65B, contract date 2026-01-14."},{"stance":"confirms","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2025-11-14","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20251117800179","title":"한미반도체 단일판매·공급계약체결 (SK하이닉스, 16억원)","title_en":"Hanmi single-supply contract (SK hynix, ₩1.6B)","excerpt":"한미반도체 DART 단일판매ㆍ공급계약: SK하이닉스, 15.7억원, 계약일 2025-11-14.","excerpt_en":"Hanmi DART single-supply contract: SK hynix, ₩1.57B, contract date 2025-11-14."},{"stance":"confirms","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2025-05-16","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20250516800319","title":"한미반도체 단일판매·공급계약체결 (SK하이닉스, 428억원)","title_en":"Hanmi single-supply contract (SK hynix, ₩42.8B)","excerpt":"한미반도체 DART 단일판매ㆍ공급계약: SK하이닉스, 428.1억원, 계약일 2025-05-16.","excerpt_en":"Hanmi DART single-supply contract: SK hynix, ₩42.81B, contract date 2025-05-16."},{"stance":"confirms","publisher":"The Elec","publisher_en":null,"kind":"news","lang":"en","published_at":null,"url":"https://www.thelec.net/news/articleView.html?idxno=11132","title":"Hanmi wins first HBM4 TC bonder order from SK hynix","title_en":null,"excerpt":"The Elec: 한미반도체 SK하이닉스 HBM TC본더 공급 보도.","excerpt_en":"The Elec: report on Hanmi supplying HBM TC bonders to SK hynix."}]},{"direction":"revenue","counterparty":"ASE (대만)","counterparty_slug":null,"confidence":"high","metric":{"type":"contract_value","unit":"KRW","as_of":"2025-05-27","basis":"단일판매ㆍ공급계약(대만 ASE)","value":8045604000,"period":"2025-05-27","basis_en":"Single-supply contract (Taiwan ASE)","qualifier":"exact"},"note":"TC본더 공급. 대만 OSAT ASE 대상 단일판매ㆍ공급계약(DART 1차). 80.5억원, 2025-05-27.","note_en":"TC bonder supply. Single-supply contract with Taiwan OSAT ASE (DART primary). ₩8.05B, 2025-05-27.","sources":[{"stance":"confirms","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2025-05-28","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20250528800084","title":"한미반도체 단일판매ㆍ공급계약 (ASE, 2025-05-27)","title_en":"Hanmi single-supply contract (ASE, 2025-05-27)","excerpt":"한미반도체 DART: 계약상대 ASE(대만), 80.5억원, 계약일 2025-05-27.","excerpt_en":"Hanmi DART: counterparty ASE (Taiwan), ₩8.05B, contract date 2025-05-27."}]},{"direction":"cost","counterparty":"부품·모듈 공급사 (Bonder Modules 外)","counterparty_slug":null,"confidence":"mid","metric":{"type":"purchase_amount","unit":"KRW","as_of":"2025-12-31","basis":"원재료 매입(Bonder Modules 外 제조장비용 부속품)","value":153159000000,"period":"FY2025","basis_en":"Raw materials (bonder modules and equipment parts)","qualifier":"84.46%_of_materials"},"note":"TC본더 제조용 부속품·모듈 매입. 원재료 매입의 84.46%. 사업보고서는 품목·금액만 공개하고 공급사명은 비공개.","note_en":"Buys parts and modules for TC bonder manufacturing. 84.46% of raw-material purchases. The filing discloses items and amounts but not supplier names.","sources":[{"stance":"confirms","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-12","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260312001230","title":"한미반도체 사업보고서 (2025.12)","title_en":"Hanmi Semiconductor business report (2025.12)","excerpt":"한미반도체 사업보고서: 주요 원재료 'Bonder Modules 外 제조장비용부속품' 매입액 153,159백만원(84.46%). 공급사명 비공개.","excerpt_en":"Hanmi business report: main raw material 'bonder modules and equipment parts' purchases of ₩153,159M (84.46%). Supplier names not disclosed."}]},{"direction":"cost","counterparty":"외주 임가공 협력사","counterparty_slug":null,"confidence":"mid","metric":{"type":"purchase_amount","unit":"KRW","as_of":"2025-12-31","basis":"외주가공비(임가공)","value":28171000000,"period":"FY2025","basis_en":"Subcontract processing","qualifier":"15.54%_of_materials"},"note":"조립·가공 외주. 원재료 매입의 15.54%. 공급사명 비공개.","note_en":"Subcontract assembly and processing. 15.54% of raw-material purchases. Supplier not disclosed.","sources":[{"stance":"confirms","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-12","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260312001230","title":"한미반도체 사업보고서 (2025.12)","title_en":"Hanmi Semiconductor business report (2025.12)","excerpt":"한미반도체 사업보고서: 외주가공비(임가공) 28,171백만원(15.54%). 협력사명 비공개.","excerpt_en":"Hanmi business report: subcontract processing of ₩28,171M (15.54%). Partner names not disclosed."}]},{"direction":"revenue","counterparty":"Samsung Electronics","counterparty_slug":"samsung-electronics","confidence":"mid","metric":null,"note":"삼성전자에 HBM TC본더 공급(SK와 공급사 공유).","note_en":"Supplies HBM TC bonders to Samsung (shared supplier with SK hynix).","sources":[]}]}