{"slug":"powertech","name":"파워텍 (PTI)","name_en":"Powertech Technology (PTI)","ticker":"6239.TW","updated_at":"2026-07-12T06:15:33.804369+00:00","canonical":"https://valuechain.wiki/powertech","same_as":["https://finance.yahoo.com/quote/6239.TW"],"citable":"밸류체인 그래프 기준 파워텍 (PTI)의 직접 연결 기업은 5곳(관계 기준 공급 2·매출 3)이고, 사슬을 2차까지 넓히면 13곳에 닿는다. 링크의 근거 출처는 6건이며 그중 1차공시가 1건이다 (valuechain.wiki, 2026-07-12 기준).","citable_en":"Per the valuechain.wiki graph, Powertech Technology (PTI) is directly linked to 5 companies (2 supply, 3 revenue relationships) and reaches 13 companies within two hops; the links are backed by 6 dated sources, 1 of them primary filings (as of 2026-07-12).","kicker":"대만상장 · 반도체 후공정 · 메모리 OSAT 5위","kicker_en":"Taiwan-listed · Semi back-end · Memory OSAT (No.5)","lead":"메모리 반도체 후공정에 특화한 대만 OSAT 세계 5위(점유 5.5%, 매출 $2.28B)로, 범용 로직 OSAT와 달리 메모리 IC 패키징(BGA·MCP·HBM 스태킹)에서 전문성을 쥔다. 마이크론·삼성·SK하이닉스의 메모리 조립·테스트를 대행해 이들 물량·가동률에 매출이 직결되고, HBM 스태킹 확대가 후공정 난이도와 단가를 함께 키운다. 관전점은 HBM 후공정 침투와 메모리 사이클이다.","lead_en":"Powertech is the world's #5 OSAT (5.5% share, $2.28B revenue) specialized in memory back-end, holding expertise in memory IC packaging (BGA, MCP, HBM stacking) unlike general logic OSATs. Contract-assembling and testing memory for Micron, Samsung and SK hynix, its revenue ties directly to their volume and utilization, and HBM stacking raises both back-end difficulty and pricing. Watch HBM back-end penetration and the memory cycle.","segments":{"fy":2025,"parts":[{"desc":"메모리 IC 패키징(BGA·MCP·HBM 스태킹) 전문 대만 OSAT. FY2025 매출 NT$749.3억(~$23.8억)·순이익 NT$72.2억·EPS NT$7.48. 메모리 3사 물량·HBM 확대에 연동되며, FOPLP(수율 95%, 2027 상반기 양산)·실리콘포토닉스로 확장. TSMC CoWoS 캐파 부족으로 美 AI 칩사 물량이 파워텍으로 넘어오는 낙수효과가 2026~27 성장 동력.","name":"메모리 패키지·테스트 OSAT 세계 5위"}],"total":"FY2025 매출 NT$749.3억(~$23.8억), 순이익 NT$72.2억, EPS NT$7.48","source":"Powertech IR / DigiTimes"},"segments_en":{"fy":2025,"parts":[{"desc":"A Taiwan OSAT specialized in memory IC packaging (BGA/MCP/HBM stacking). FY2025 revenue NT$74.93B (~$2.38B), net profit NT$7.22B, EPS NT$7.48. Tied to the memory-three's volume and HBM growth, expanding into FOPLP (95% yield, mass production 1H2027) and silicon photonics; a TSMC CoWoS capacity crunch spilling US AI-chip volume over to Powertech is a 2026-27 growth driver.","name":"World No.5 memory package/test OSAT"}],"total":"FY2025 revenue NT$74.93B (~$2.38B), net profit NT$7.22B, EPS NT$7.48","source":"Powertech IR / DigiTimes"},"returns_yearly":{"2021":4.8,"2022":-7.5,"2023":86,"2024":-16,"2025":128.6,"2026":26},"return_asof":"2026-07-09","value_chain":{"leading":[{"slug":"dell","name":"Dell","name_en":"Dell Technologies","tier":3,"returns_yearly":{"2021":51.2,"2022":-26.6,"2023":95.9,"2024":53,"2025":11.2,"2026":248.1}},{"slug":"seagate","name":"Seagate","name_en":"Seagate Technology","tier":3,"returns_yearly":{"2021":87.5,"2022":-51.4,"2023":69.1,"2024":4.1,"2025":225.3,"2026":231.4}},{"slug":"lenovo","name":"Lenovo","name_en":"Lenovo","tier":3,"returns_yearly":{"2021":-4.6,"2022":-20.9,"2023":36.2,"2024":18.2,"2025":-0.6,"2026":175.7}},{"slug":"nebius","name":"Nebius","name_en":"Nebius Group","tier":3,"returns_yearly":{"2025":202.2,"2026":162.4}},{"slug":"hpe","name":"HPE","name_en":"Hewlett Packard Enterprise","tier":3,"returns_yearly":{"2021":37.4,"2022":4.5,"2023":9.7,"2024":29.1,"2025":15.5,"2026":104}},{"slug":"terawulf","name":"TeraWulf","name_en":"TeraWulf","tier":3,"returns_yearly":{"2021":77.1,"2022":-95.5,"2023":258.2,"2024":135.8,"2025":103,"2026":91.2}},{"slug":"datadog","name":"Datadog","name_en":"Datadog","tier":3,"returns_yearly":{"2021":80.9,"2022":-58.7,"2023":65.1,"2024":17.7,"2025":-4.8,"2026":89.4}},{"slug":"lg-electronics","name":"LG전자","name_en":"LG Electronics","tier":3,"returns_yearly":{"2021":-16.2,"2022":-20.9,"2023":-5.8,"2024":-9.5,"2025":19.2,"2026":85.5}},{"slug":"eoptolink","name":"Eoptolink","name_en":"Eoptolink","tier":3,"returns_yearly":{"2021":-10.1,"2022":-27.7,"2023":136.6,"2024":197,"2025":368.8,"2026":74.9}},{"slug":"aurora","name":"Aurora Innovation","name_en":"Aurora Innovation","tier":3,"returns_yearly":{"2022":-89.3,"2023":261.2,"2024":44.2,"2025":-39,"2026":66.1}},{"slug":"kyocera","name":"교세라","name_en":"Kyocera","tier":3,"returns_yearly":{"2021":7.5,"2022":-2.1,"2023":33.8,"2024":-24,"2025":46.7,"2026":63}},{"slug":"crowdstrike","name":"CrowdStrike","name_en":"CrowdStrike","tier":3,"returns_yearly":{"2021":-3.3,"2022":-48.6,"2023":142.5,"2024":34,"2025":37,"2026":59.7}},{"slug":"mercury-systems","name":"Mercury Systems","name_en":"Mercury Systems","tier":3,"returns_yearly":{"2021":-37.5,"2022":-18.7,"2023":-18.3,"2024":14.8,"2025":73.8,"2026":47.9}},{"slug":"asustek","name":"에이수스(ASUS)","name_en":"ASUSTeK Computer","tier":3,"returns_yearly":{"2021":35.5,"2022":-12.9,"2023":72,"2024":41.1,"2025":-14.1,"2026":46.7}},{"slug":"wiwynn","name":"Wiwynn","name_en":"Wiwynn","tier":3,"returns_yearly":{"2021":24.7,"2022":-22.3,"2023":206.4,"2024":3.5,"2025":64.4,"2026":45.1}},{"slug":"illumina","name":"Illumina","name_en":"Illumina","tier":3,"returns_yearly":{"2021":2.8,"2022":-46.9,"2023":-31.1,"2024":-1.3,"2025":-1.8,"2026":45}},{"slug":"gigabyte","name":"기가바이트","name_en":"Gigabyte Technology","tier":3,"returns_yearly":{"2021":82.3,"2022":-3.4,"2023":173.2,"2024":-15.9,"2025":-4.7,"2026":44.4}},{"slug":"arista","name":"Arista Networks","name_en":"Arista Networks","tier":3,"returns_yearly":{"2021":97.9,"2022":-15.6,"2023":94.1,"2024":87.7,"2025":18.5,"2026":42.7}},{"slug":"cloudflare","name":"Cloudflare","name_en":"Cloudflare","tier":3,"returns_yearly":{"2021":73,"2022":-65.6,"2023":84.2,"2024":29.3,"2025":83.1,"2026":36.1}},{"slug":"quanta","name":"Quanta","name_en":"Quanta Computer","tier":3,"returns_yearly":{"2021":22.2,"2022":-12.8,"2023":254.5,"2024":12.7,"2025":8.9,"2026":33.4}},{"slug":"coreweave","name":"CoreWeave","name_en":"CoreWeave","tier":3,"returns_yearly":{"2026":24.1}},{"slug":"sk-telecom","name":"SK텔레콤","name_en":"SK Telecom","tier":3,"returns_yearly":{"2021":7.9,"2022":-12,"2023":15.8,"2024":15.5,"2025":37.5,"2026":23.4}},{"slug":"celestica","name":"Celestica","name_en":"Celestica","tier":3,"returns_yearly":{"2021":37.9,"2022":1.3,"2023":159.8,"2024":215.2,"2025":220.3,"2026":21.7}},{"slug":"snowflake","name":"Snowflake","name_en":"Snowflake","tier":3,"returns_yearly":{"2021":20.4,"2022":-57.6,"2023":38.6,"2024":-22.4,"2025":42.1,"2026":19.2}},{"slug":"geely-auto","name":"지리자동차","name_en":"Geely Auto","tier":3,"returns_yearly":{"2021":-40.8,"2022":-22.9,"2023":-40.3,"2024":98.5,"2025":14.5,"2026":18.9}},{"slug":"wistron","name":"위스트론","name_en":"Wistron","tier":3,"returns_yearly":{"2021":7.9,"2022":9.7,"2023":272.7,"2024":-1.6,"2025":22.7,"2026":14.8}},{"slug":"alphabet","name":"알파벳 (구글)","name_en":"Alphabet (Google)","tier":3,"returns_yearly":{"2021":65.3,"2022":-39.1,"2023":58.3,"2024":36,"2025":66,"2026":14.3}},{"slug":"foxconn","name":"Foxconn","name_en":"Foxconn (Hon Hai)","tier":3,"returns_yearly":{"2021":-5.1,"2022":2.8,"2023":7.8,"2024":80.1,"2025":26.9,"2026":10.9}},{"slug":"iren","name":"IREN","name_en":"IREN","tier":3,"returns_yearly":{"2022":-92.3,"2023":472,"2024":37.3,"2025":284.6,"2026":8.9}},{"slug":"amazon","name":"아마존","name_en":"Amazon","tier":3,"returns_yearly":{"2021":2.4,"2022":-49.6,"2023":80.9,"2024":44.4,"2025":5.2,"2026":6.3}},{"slug":"meta","name":"메타 플랫폼스","name_en":"Meta Platforms","tier":3,"returns_yearly":{"2021":23.1,"2022":-64.2,"2023":194.1,"2024":66,"2025":13.1,"2026":1.6}},{"slug":"tempus-ai","name":"Tempus AI","name_en":"Tempus AI","tier":3,"returns_yearly":{"2025":74.9,"2026":-1.4}},{"slug":"ibm","name":"IBM","name_en":"IBM","tier":3,"returns_yearly":{"2021":16.7,"2022":10.6,"2023":21.8,"2024":39.3,"2025":38.2,"2026":-1.6}},{"slug":"super-micro","name":"Super Micro","name_en":"Super Micro","tier":3,"returns_yearly":{"2021":38.8,"2022":86.8,"2023":246.2,"2024":7.2,"2025":-4,"2026":-3.3}},{"slug":"general-motors","name":"제너럴 모터스","name_en":"General Motors","tier":3,"returns_yearly":{"2021":40.8,"2022":-42.4,"2023":7.9,"2024":49.8,"2025":54.2,"2026":-3.8}},{"slug":"ionq","name":"IonQ","name_en":"IonQ","tier":3,"returns_yearly":{"2022":-79.3,"2023":259.1,"2024":237.1,"2025":7.4,"2026":-4.5}},{"slug":"schrodinger","name":"Schrödinger","name_en":"Schrodinger","tier":3,"returns_yearly":{"2021":-56,"2022":-46.3,"2023":91.5,"2024":-46.1,"2025":-7.3,"2026":-7.8}},{"slug":"hyundai-motor-company","name":"현대차","name_en":"Hyundai Motor Company","tier":3,"returns_yearly":{"2021":-16.7,"2022":-4.7,"2023":16.2,"2024":12.3,"2025":158.8,"2026":-7.8}},{"slug":"uber","name":"Uber","name_en":"Uber","tier":3,"returns_yearly":{"2021":-17.8,"2022":-41,"2023":149,"2024":-2,"2025":35.5,"2026":-8.8}},{"slug":"tesla","name":"Tesla","name_en":"Tesla","tier":3,"returns_yearly":{"2021":49.8,"2022":-65,"2023":101.7,"2024":62.5,"2025":11.4,"2026":-9.3}},{"slug":"recursion","name":"Recursion Pharmaceuticals","name_en":"Recursion Pharmaceuticals","tier":3,"returns_yearly":{"2022":-55,"2023":27.9,"2024":-31.4,"2025":-39.5,"2026":-13}},{"slug":"toyota","name":"Toyota Motor Corporation","name_en":"Toyota Motor Corporation","tier":3,"returns_yearly":{"2021":58.1,"2022":-13.4,"2023":63,"2024":1.8,"2025":21.8,"2026":-18.2}},{"slug":"microsoft","name":"마이크로소프트","name_en":"Microsoft","tier":3,"returns_yearly":{"2021":52.5,"2022":-28,"2023":58.2,"2024":12.9,"2025":15.6,"2026":-20}},{"slug":"alibaba","name":"알리바바","name_en":"Alibaba Group","tier":3,"returns_yearly":{"2021":-49,"2022":-25.8,"2023":-10.8,"2024":11.8,"2025":75.8,"2026":-22.7}},{"slug":"tencent-holdings-limited","name":"텐센트","name_en":"Tencent Holdings Limited","tier":3,"returns_yearly":{"2021":-28.6,"2022":-14.2,"2023":-28.7,"2024":49.8,"2025":52.1,"2026":-23.2}},{"slug":"baidu","name":"바이두","name_en":"Baidu","tier":3,"returns_yearly":{"2022":-8.2,"2023":-23.4,"2024":-13.5,"2025":74.2,"2026":-24.5}},{"slug":"rigetti","name":"Rigetti Computing","name_en":"Rigetti Computing","tier":3,"returns_yearly":{"2022":-92.9,"2023":35.1,"2024":1449.2,"2025":45.2,"2026":-25.3}},{"slug":"xiaomi","name":"샤오미","name_en":"Xiaomi","tier":3,"returns_yearly":{"2021":-43.9,"2022":-21.1,"2023":-4.6,"2024":209.7,"2025":-6.9,"2026":-27.2}},{"slug":"oracle","name":"Oracle","name_en":"Oracle","tier":3,"returns_yearly":{"2021":36.9,"2022":-4.6,"2023":30.9,"2024":60,"2025":18.1,"2026":-27.4}},{"slug":"palantir","name":"Palantir","name_en":"Palantir Technologies","tier":3,"returns_yearly":{"2021":-22.7,"2022":-64.7,"2023":167.4,"2024":340.5,"2025":135,"2026":-28.7}},{"slug":"servicenow","name":"ServiceNow","name_en":"ServiceNow","tier":3,"returns_yearly":{"2021":17.9,"2022":-40.2,"2023":82,"2024":50.1,"2025":-27.7,"2026":-29.7}},{"slug":"kratos","name":"Kratos","name_en":"Kratos Defense","tier":3,"returns_yearly":{"2021":-29.3,"2022":-46.8,"2023":96.6,"2024":30,"2025":187.8,"2026":-36.5}},{"slug":"pony-ai","name":"Pony.ai","name_en":"Pony.ai","tier":3,"returns_yearly":{"2025":1,"2026":-54.6}},{"slug":"anthropic","name":"Anthropic","name_en":"Anthropic","tier":3,"returns_yearly":null},{"slug":"openai","name":"OpenAI","name_en":"OpenAI","tier":3,"returns_yearly":null},{"slug":"marvell","name":"Marvell","name_en":"Marvell","tier":2,"returns_yearly":{"2021":84.6,"2022":-57.5,"2023":63.7,"2024":83.8,"2025":-22.8,"2026":177.8}},{"slug":"amd","name":"AMD","name_en":"AMD","tier":2,"returns_yearly":{"2021":56.9,"2022":-55,"2023":127.6,"2024":-18.1,"2025":77.3,"2026":160.5}},{"slug":"pure-storage","name":"에버퓨어 (구 퓨어스토리지)","name_en":"Everpure (formerly Pure Storage)","tier":2,"returns_yearly":{"2021":44,"2022":-17.8,"2023":33.3,"2024":72.3,"2025":9.1,"2026":18.4}},{"slug":"apple","name":"Apple","name_en":"Apple","tier":2,"returns_yearly":{"2021":34.6,"2022":-26.4,"2023":49,"2024":30.7,"2025":9.1,"2026":16.2}},{"slug":"broadcom","name":"Broadcom","name_en":"Broadcom","tier":2,"returns_yearly":{"2021":56.5,"2022":-13.3,"2023":104.2,"2024":110.5,"2025":50.6,"2026":16}},{"slug":"nvidia","name":"NVIDIA","name_en":"NVIDIA","tier":2,"returns_yearly":{"2021":125.5,"2022":-50.3,"2023":239,"2024":171.2,"2025":38.9,"2026":13.3}},{"slug":"qualcomm","name":"Qualcomm","name_en":"Qualcomm","tier":2,"returns_yearly":{"2021":22.3,"2022":-38.6,"2023":35.1,"2024":8.3,"2025":13.8,"2026":11.7}},{"slug":"phison","name":"Phison","name_en":"Phison Electronics","tier":2,"returns_yearly":{"2021":26.8,"2022":-10.7,"2023":45.1,"2024":-6.7,"2025":418.3,"2026":-6}},{"slug":"micron","name":"Micron Technology","name_en":"Micron Technology","tier":1,"returns_yearly":{"2021":24.2,"2022":-45.9,"2023":71.9,"2024":-1,"2025":240.2,"2026":243.3}},{"slug":"sk-hynix","name":"SK하이닉스","name_en":"SK hynix","tier":1,"returns_yearly":{"2021":-0.4,"2022":-25.6,"2023":53.9,"2024":48.6,"2025":361.1,"2026":140.3}},{"slug":"samsung-electronics","name":"삼성전자","name_en":"Samsung Electronics","tier":1,"returns_yearly":{"2021":-9,"2022":-14.2,"2023":20.9,"2024":-26.4,"2025":212.9,"2026":77.9}}],"benefiting":[{"slug":"kulicke-soffa","name":"Kulicke & Soffa","name_en":"Kulicke & Soffa","tier":1,"returns_yearly":{"2021":92.4,"2022":-25.8,"2023":25.5,"2024":-13.2,"2025":-0.3,"2026":150.1}},{"slug":"advantest","name":"Advantest","name_en":"Advantest","tier":1,"returns_yearly":{"2021":17,"2022":-2.3,"2023":155.7,"2024":49.5,"2025":196,"2026":17.1}}],"analysis":"파워텍의 논점은 '메모리에 특화된 후공정 외주 레버리지'다. 범용 로직 OSAT와 달리 메모리 IC 패키징(BGA·MCP·HBM 스태킹)에 전문성이 있어, 마이크론·삼성·SK하이닉스의 메모리 출하·가동률에 매출이 직결된다. HBM 스태킹은 층수가 올라갈수록 수율·난이도가 급증해 단가·물량을 함께 키우는 구조적 수요이나, 고객이 메모리 3사로 좁아 사이클 변동을 그대로 얹는다 — 상승기엔 물량 레버리지가 먼저 붙는다. 리스크는 메모리 사이클과 고객 집중. 그래프 파급: 마이크론·삼성·SK하이닉스 메모리 물량이 수요를 끌고, Advantest·K&S 장비가 캐파의 상류 병목.","analysis_en":"Powertech's thesis is memory-specialized back-end outsourcing leverage. Unlike general logic OSATs, its expertise in memory IC packaging (BGA, MCP, HBM stacking) ties revenue directly to Micron, Samsung and SK hynix memory shipments and utilization. HBM stacking sees yield and difficulty spike as layers rise, growing both pricing and volume as structural demand — but with customers narrowed to the memory three, it loads cycle swings directly, with volume leverage attaching first in upturns. Risks are the memory cycle and customer concentration. Graph propagation: Micron/Samsung/SK hynix memory volume pulls demand, while Advantest and K&S equipment are the upstream capacity bottleneck.","analysis_asof":"2026-07-09"},"edges":[{"direction":"revenue","counterparty":"Micron Technology","counterparty_slug":"micron","confidence":"high","metric":{"fy":2025,"eps_ntd":7.48,"group_rev_ntbn":74.93,"osat_share_pct":5.5,"net_profit_ntbn":7.22,"group_rev_usd_bn":2.38},"note":"마이크론 메모리의 패키징·테스트를 대행 — 메모리 3사 중 성장 탄력이 큰 고객으로 물량에 직결.","note_en":"Contract packaging/test for Micron memory — a high-momentum customer among the memory three, tied to volume.","sources":[{"stance":"confirms","publisher":"DigiTimes","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2026-04-29","url":"https://www.digitimes.com/news/a20260429PD241/packaging-growth-testing-powertech-taiwan.html","title":"파워텍, 2026 capex US$16억으로 상향·AI 패키징 성장","title_en":"Powertech lifts 2026 capex to US$1.6bn, targets AI packaging growth","excerpt":"Powertech FY2025 revenue NT$74.93B (~$2.38B), net profit NT$7.22B, EPS NT$7.48; the world's leading memory packaging/test provider across DRAM, NAND and HBM; 2026 capex lifted to ~US$1.6bn for AI packaging.","excerpt_en":"PTI FY2025 NT$74.93B (~$2.38B), net profit NT$7.22B; leading memory OSAT; 2026 capex ~US$1.6bn."},{"stance":"mentions","publisher":"TrendForce","publisher_en":"TrendForce","kind":"research","lang":"en","published_at":"2025-11-10","url":"https://www.trendforce.com/news/2025/11/10/news-tsmc-cowos-capacity-crunch-reportedly-pushes-u-s-ai-chipmakers-to-powertech-through-2027/","title":"TSMC CoWoS 캐파 부족, 美 AI 칩사 2027년까지 파워텍으로","title_en":"TSMC CoWoS crunch pushes US AI chipmakers to Powertech through 2027","excerpt":"TSMC CoWoS 캐파 부족으로 美 AI 칩사 물량이 2027년까지 파워텍으로 이전 — AMD·브로드컴이 FOPLP를 지원, 성장률 연 ~19% 전망.","excerpt_en":"TSMC CoWoS crunch spills US AI-chip volume to Powertech through 2027; AMD/Broadcom back its FOPLP; ~19%/yr growth forecast."},{"stance":"confirms","publisher":"디지털투데이","publisher_en":"Digital Today","kind":"news","lang":"ko","published_at":"2025-06-01","url":"https://www.digitaltoday.co.kr/news/articleView.html?idxno=528364","title":"OSAT 실적 반등, JCET 중국 1위","title_en":"OSAT rebound; JCET China No.1","excerpt":"HBM 효과로 OSAT 실적 반등(PTI 등)","excerpt_en":"OSAT rebound on HBM (PTI etc.)"},{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"analysis","lang":"en","published_at":"2025-05-13","url":"https://www.trendforce.com/presscenter/news/20250513-12577.html","title":"2024 OSAT 톱10(PTI 5위)","title_en":"Top 10 OSAT 2024 (PTI No.5)","excerpt":"Micron Technology에 메모리 패키징·테스트 공급/제공.","excerpt_en":"Provides memory packaging and test to Micron Technology."},{"stance":"confirms","publisher":"파워텍","publisher_en":"PTI","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.pti.com.tw/en/","title":"PTI IR","title_en":"PTI IR","excerpt":"Micron Technology에 메모리 패키징·테스트 공급/제공.","excerpt_en":"Provides memory packaging and test to Micron Technology."},{"stance":"confirms","publisher":"회사 IR/거래소 공시","publisher_en":"Company IR / exchange filing","kind":"filing","lang":"en","published_at":"2025-04-01","url":"https://www.pti.com.tw/en/Investors/","title":"PTI 연차보고서(TWSE)","title_en":"PTI annual report (TWSE)","excerpt":"연차보고서: 매출·고객·사업.","excerpt_en":"Annual report: revenue, customers, business."}]},{"direction":"cost","counterparty":"Advantest","counterparty_slug":"advantest","confidence":"mid","metric":{"fy":2026,"foplp_mp":"1H2027","foplp_yield_pct":95,"capex_2026_usd_bn":1.6},"note":"어드밴테스트에서 테스트·본딩 장비를 조달 — 후공정 캐파 증설이 곧 장비 리드타임 병목.","note_en":"Sources test/bonding equipment from Advantest — back-end capacity expansion runs into equipment lead-time bottlenecks.","sources":[{"stance":"confirms","publisher":"DigiTimes","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2026-04-29","url":"https://www.digitimes.com/news/a20260429PD241/packaging-growth-testing-powertech-taiwan.html","title":"파워텍, 2026 capex US$16억으로 상향·AI 패키징 성장","title_en":"Powertech lifts 2026 capex to US$1.6bn, targets AI packaging growth","excerpt":"PTI lifted 2026 capex to ~US$1.6bn for AI packaging/test; FOPLP yield reached 95% with mass production slated for 1H2027 — equipment lead time gates back-end capacity.","excerpt_en":"PTI 2026 capex ~US$1.6bn; FOPLP 95% yield, MP 1H2027; equipment lead time gates capacity."},{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"analysis","lang":"en","published_at":"2025-05-13","url":"https://www.trendforce.com/presscenter/news/20250513-12577.html","title":"2024 OSAT 톱10(PTI 5위)","title_en":"Top 10 OSAT 2024 (PTI No.5)","excerpt":"Advantest에서 테스트·본딩 장비 매입.","excerpt_en":"Buys test and bonding equipment from Advantest."},{"stance":"confirms","publisher":"파워텍","publisher_en":"PTI","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.pti.com.tw/en/","title":"PTI IR","title_en":"PTI IR","excerpt":"Advantest에서 테스트·본딩 장비 매입.","excerpt_en":"Buys test and bonding equipment from Advantest."}]},{"direction":"revenue","counterparty":"SK하이닉스","counterparty_slug":"sk-hynix","confidence":"mid","metric":{"fy":2025,"group_rev_ntbn":74.93,"osat_share_pct":5.5},"note":"SK하이닉스 메모리 후공정을 대행 — HBM 스태킹 확대가 난이도·단가를 높이는 대표 수요.","note_en":"Contract back-end for SK hynix memory — HBM stacking raises difficulty and pricing, a key demand.","sources":[{"stance":"confirms","publisher":"DigiTimes","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2026-04-29","url":"https://www.digitimes.com/news/a20260429PD241/packaging-growth-testing-powertech-taiwan.html","title":"파워텍, 2026 capex US$16억으로 상향·AI 패키징 성장","title_en":"Powertech lifts 2026 capex to US$1.6bn, targets AI packaging growth","excerpt":"Powertech maintains close partnerships with major memory makers across DRAM, NAND and HBM packaging/test; FY2025 revenue NT$74.93B; HBM/FOPLP a growing AI revenue share.","excerpt_en":"PTI partners the memory majors in DRAM/NAND/HBM package-test; FY2025 NT$74.93B; HBM/FOPLP a growing AI share."},{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"analysis","lang":"en","published_at":"2025-05-13","url":"https://www.trendforce.com/presscenter/news/20250513-12577.html","title":"2024 OSAT 톱10(PTI 5위)","title_en":"Top 10 OSAT 2024 (PTI No.5)","excerpt":"SK하이닉스에 메모리 패키징·테스트 공급/제공.","excerpt_en":"Provides memory packaging and test to SK hynix."},{"stance":"confirms","publisher":"파워텍","publisher_en":"PTI","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.pti.com.tw/en/","title":"PTI IR","title_en":"PTI IR","excerpt":"SK하이닉스에 메모리 패키징·테스트 공급/제공.","excerpt_en":"Provides memory packaging and test to SK hynix."}]},{"direction":"revenue","counterparty":"삼성전자","counterparty_slug":"samsung-electronics","confidence":"mid","metric":{"fy":2025,"group_rev_ntbn":74.93,"osat_share_pct":5.5},"note":"삼성전자 메모리의 패키징·테스트를 대행 — 팹 밖 후공정 외주라 삼성 메모리 물량이 곧 매출.","note_en":"Contract packaging/test for Samsung memory — out-of-fab back-end, so Samsung's memory volume is the revenue.","sources":[{"stance":"confirms","publisher":"DigiTimes","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2026-04-29","url":"https://www.digitimes.com/news/a20260429PD241/packaging-growth-testing-powertech-taiwan.html","title":"파워텍, 2026 capex US$16억으로 상향·AI 패키징 성장","title_en":"Powertech lifts 2026 capex to US$1.6bn, targets AI packaging growth","excerpt":"Powertech maintains close partnerships with major memory makers across DRAM, NAND and HBM packaging/test; FY2025 revenue NT$74.93B; HBM/FOPLP a growing AI revenue share.","excerpt_en":"PTI partners the memory majors in DRAM/NAND/HBM package-test; FY2025 NT$74.93B; HBM/FOPLP a growing AI share."},{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"analysis","lang":"en","published_at":"2025-05-13","url":"https://www.trendforce.com/presscenter/news/20250513-12577.html","title":"2024 OSAT 톱10(PTI 5위)","title_en":"Top 10 OSAT 2024 (PTI No.5)","excerpt":"삼성전자에 메모리 패키징·테스트 공급/제공.","excerpt_en":"Provides memory packaging and test to Samsung Electronics."},{"stance":"confirms","publisher":"파워텍","publisher_en":"PTI","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.pti.com.tw/en/","title":"PTI IR","title_en":"PTI IR","excerpt":"삼성전자에 메모리 패키징·테스트 공급/제공.","excerpt_en":"Provides memory packaging and test to Samsung Electronics."}]},{"direction":"cost","counterparty":"Kulicke & Soffa","counterparty_slug":"kulicke-soffa","confidence":"mid","metric":{"fy":2026,"role":"HBM_stacking_bonder","capex_2026_usd_bn":1.6},"note":"쿨리케앤소파에서 본딩 장비를 조달 — HBM 스태킹 등 첨단 패키징 캐파의 상류 장비 공급.","note_en":"Sources bonding equipment from Kulicke & Soffa — upstream tooling for advanced-packaging (HBM stacking) capacity.","sources":[{"stance":"confirms","publisher":"DigiTimes","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2026-04-29","url":"https://www.digitimes.com/news/a20260429PD241/packaging-growth-testing-powertech-taiwan.html","title":"파워텍, 2026 capex US$16억으로 상향·AI 패키징 성장","title_en":"Powertech lifts 2026 capex to US$1.6bn, targets AI packaging growth","excerpt":"Advanced packaging (HBM stacking, FOPLP) depends on bonding equipment; K&S is a leading bonder supplier, its tools upstream of PTI's ~US$1.6bn 2026 capacity build.","excerpt_en":"K&S bonders are upstream of PTI's HBM-stacking/FOPLP capacity (2026 capex ~US$1.6bn)."},{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"analysis","lang":"en","published_at":"2025-05-13","url":"https://www.trendforce.com/presscenter/news/20250513-12577.html","title":"2024 OSAT 톱10(PTI 5위)","title_en":"Top 10 OSAT 2024 (PTI No.5)","excerpt":"Kulicke & Soffa에서 테스트·본딩 장비 매입.","excerpt_en":"Buys test and bonding equipment from Kulicke & Soffa."},{"stance":"confirms","publisher":"파워텍","publisher_en":"PTI","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.pti.com.tw/en/","title":"PTI IR","title_en":"PTI IR","excerpt":"Kulicke & Soffa에서 테스트·본딩 장비 매입.","excerpt_en":"Buys test and bonding equipment from Kulicke & Soffa."}]},{"direction":"cost","counterparty":"원재료·소재·R&D (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"제조용 원재료·소재·R&D(비공개).","note_en":"Materials and R&D (undisclosed).","sources":[{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"analysis","lang":"en","published_at":"2025-05-13","url":"https://www.trendforce.com/presscenter/news/20250513-12577.html","title":"2024 OSAT 톱10(PTI 5위)","title_en":"Top 10 OSAT 2024 (PTI No.5)","excerpt":"제조용 원재료·소재·R&D(비공개).","excerpt_en":"Materials and R&D (undisclosed)."}]}]}