{"slug":"nxp","name":"NXP반도체","name_en":"NXP Semiconductors","ticker":"NXPI","updated_at":"2026-07-12T06:26:59.626782+00:00","canonical":"https://valuechain.wiki/nxp","same_as":["https://finance.yahoo.com/quote/NXPI","https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=1413447"],"citable":"밸류체인 그래프 기준 NXP반도체의 직접 연결 기업은 5곳(관계 기준 공급 4·매출 1)이고, 사슬을 2차까지 넓히면 38곳에 닿는다. 링크의 근거 출처는 9건이며 그중 1차공시가 4건이다 (valuechain.wiki, 2026-07-12 기준).","citable_en":"Per the valuechain.wiki graph, NXP Semiconductors is directly linked to 5 companies (4 supply, 1 revenue relationships) and reaches 38 companies within two hops; the links are backed by 9 dated sources, 4 of them primary filings (as of 2026-07-12).","kicker":"나스닥 · 차량용 반도체 · 차량·MCU 3강(인피니언·NXP·르네사스)","kicker_en":"NASDAQ · Automotive chips · Auto/MCU top-3 (Infineon, NXP, Renesas)","lead":"인피니언·르네사스와 함께 차량용 반도체 3강 중 하나로, 차량용 프로세서·MCU와 차량·모바일 커넥티비티(NFC/UWB) 칩을 주력으로 한다. FY2025 매출 $122.69억(-3%) 중 차량용이 58%($71.16억)로 절대 축이나, 차량 재고조정으로 보합에 그쳤고 모바일(+6%)·산업IoT가 이를 일부 상쇄했다. 선단 로직은 자체 팹 대신 TSMC에 위탁해(차세대 차량 프로세서 S32를 5나노에 생산) 자본을 아끼는 팹라이트 구조이고, 후공정은 JCET 같은 OSAT를, 설계는 시높시스·케이던스 EDA를 활용한다.","lead_en":"One of the top three automotive chipmakers with Infineon and Renesas, led by auto processors/MCUs and automotive/mobile connectivity (NFC/UWB) chips. In FY2025 revenue of $12.269B (-3%), Automotive was the dominant axis at 58% ($7.116B) but stayed flat amid an auto inventory correction, partly offset by Mobile (+6%) and Industrial & IoT. It runs fab-lite, outsourcing leading-edge logic to TSMC (its next-gen S32 auto processor on 5nm) instead of its own fabs, using OSATs like JCET for back-end and Synopsys/Cadence EDA for design.","segments":{"fy":2025,"parts":[{"desc":"매출 $71.16억(전체 58%, 전년 flat). 프로세서·MCU·믹스드시그널. 전동화·SDV로 대당 반도체 탑재량 증가가 구조적 수요이나 FY2025는 차량 재고조정으로 보합.","name":"차량용 반도체"},{"desc":"매출 $22.73억(+0%). 산업·IoT용 MCU·프로세서.","name":"산업·IoT"},{"desc":"매출 $15.84억(+6%). 애플 등에 NFC/UWB 커넥티비티 칩 — 차량 밖 성장축.","name":"모바일"},{"desc":"매출 $12.96억(-24%). 통신·네트워킹 — FY2025 최대 감소 부문.","name":"통신인프라·기타"}],"total":"FY2025 매출 $122.69억(-3%), GAAP 순이익 $20.21억·매출총이익률 54.7%·희석EPS $7.95. 차량용 $71.16억(전체 58%·전년 flat), 산업·IoT $22.73억(+0%), 모바일 $15.84억(+6%), 통신인프라·기타 $12.96억(-24%).","source":"https://www.sec.gov/Archives/edgar/data/1413447/000141344726000008/nxpi-20251231.htm"},"segments_en":{"fy":2025,"parts":[{"desc":"Revenue $7.116B (58% of total, flat YoY). Processors, MCUs, mixed-signal. Rising chip content per vehicle from electrification/SDV is structural demand, but FY2025 was flat amid an auto inventory correction.","name":"Automotive"},{"desc":"Revenue $2.273B (+0%). MCUs/processors for industrial and IoT.","name":"Industrial & IoT"},{"desc":"Revenue $1.584B (+6%). NFC/UWB connectivity chips (e.g., to Apple) — the growth axis beyond vehicles.","name":"Mobile"},{"desc":"Revenue $1.296B (-24%). Comms/networking — the largest-declining segment in FY2025.","name":"Comms Infrastructure & Other"}],"total":"FY2025 revenue $12.269B (-3%), GAAP net income $2.021B, gross margin 54.7%, diluted EPS $7.95. Automotive $7.116B (58%, flat), Industrial & IoT $2.273B (+0%), Mobile $1.584B (+6%), Comms Infrastructure & Other $1.296B (-24%).","source":"https://www.sec.gov/Archives/edgar/data/1413447/000141344726000008/nxpi-20251231.htm"},"returns_yearly":{"2021":44.8,"2022":-29.2,"2023":48.4,"2024":-8,"2025":6.4,"2026":35.8},"return_asof":"2026-07-10","value_chain":{"leading":[{"slug":"apple","name":"Apple","name_en":"Apple","tier":1,"returns_yearly":{"2021":34.6,"2022":-26.4,"2023":49,"2024":30.7,"2025":9.1,"2026":16.2}}],"benefiting":[{"slug":"jcet","name":"JCET","name_en":"JCET (Jiangsu Changjiang Electronics)","tier":1,"returns_yearly":{"2021":-34,"2022":0.2,"2023":-15.2,"2024":73.3,"2025":28,"2026":104.6}},{"slug":"tsmc","name":"TSMC","name_en":"TSMC","tier":1,"returns_yearly":{"2021":12.1,"2022":-36.7,"2023":42.3,"2024":92.6,"2025":55.9,"2026":43.6}},{"slug":"sumco","name":"섬코","name_en":"SUMCO 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High-Tech","tier":2,"returns_yearly":null},{"slug":"ichor-holdings","name":"이코르","name_en":"Ichor Holdings","tier":3,"returns_yearly":{"2021":52.7,"2022":-41.7,"2023":25.4,"2024":-4.2,"2025":-42.8,"2026":444.2}},{"slug":"mks-instruments","name":"MKS Instruments","name_en":"MKS Instruments","tier":3,"returns_yearly":{"2021":16.4,"2022":-51,"2023":22.6,"2024":2.2,"2025":54.4,"2026":131}},{"slug":"advanced-energy","name":"어드밴스드에너지","name_en":"Advanced Energy Industries","tier":3,"returns_yearly":{"2021":-5.7,"2022":-5.4,"2023":27.5,"2024":6.6,"2025":81.6,"2026":47.2}},{"slug":"smc","name":"SMC Corporation","name_en":"SMC Corporation","tier":3,"returns_yearly":{"2021":0.9,"2022":4.5,"2023":28.6,"2024":-28,"2025":4.2,"2026":26.6}},{"slug":"dupont","name":"듀폰","name_en":"DuPont","tier":3,"returns_yearly":{"2021":15.4,"2022":-13.4,"2023":14.4,"2024":1,"2025":28.7,"2026":12.6}},{"slug":"yokogawa-electric","name":"요코가와전기","name_en":"Yokogawa Electric","tier":3,"returns_yearly":{"2021":-15.9,"2022":23.6,"2023":30.6,"2024":18.8,"2025":52.3,"2026":9.4}},{"slug":"wonik-qnc","name":"원익QnC","name_en":"Wonik QnC","tier":3,"returns_yearly":{"2021":26.2,"2022":2,"2023":11.9,"2024":-33.7,"2025":53.4,"2026":9.3}},{"slug":"siemens-ag","name":"지멘스","name_en":"Siemens AG","tier":3,"returns_yearly":{"2021":12.2,"2022":5.1,"2023":20.1,"2024":28,"2025":26.4,"2026":8.7}},{"slug":"tck","name":"티씨케이","name_en":"TCK (Tokai Carbon Korea)","tier":3,"returns_yearly":{"2021":-10.1,"2022":-16.9,"2023":2.8,"2024":-28.7,"2025":225.7,"2026":-2.5}},{"slug":"hoya","name":"호야","name_en":"Hoya Corporation","tier":3,"returns_yearly":{"2021":10.8,"2022":-3,"2023":34.4,"2024":11.3,"2025":24.9,"2026":-2.9}},{"slug":"hitachi","name":"히타치","name_en":"Hitachi","tier":3,"returns_yearly":{"2021":40.6,"2022":16.7,"2023":75.4,"2024":71.1,"2025":37.5,"2026":-11.8}},{"slug":"hana-materials","name":"하나머티리얼즈","name_en":"Hana Materials","tier":3,"returns_yearly":{"2021":106,"2022":-30.5,"2023":26.1,"2024":-47.4,"2025":173.9,"2026":-15.7}},{"slug":"carl-zeiss-smt","name":"Carl Zeiss SMT","name_en":"Carl Zeiss SMT","tier":3,"returns_yearly":null},{"slug":"trumpf","name":"TRUMPF","name_en":"TRUMPF","tier":3,"returns_yearly":null}],"analysis":"투자 논점은 차량 전동화·SDV로 대당 반도체 탑재량이 늘어나는 구조적 수요에 올라탄 차량용 3강 지위다. 다만 이 구조적 수요가 FY2025엔 현실화되지 못해, 차량용 매출($71.16억, 58%)이 재고조정으로 보합에 머물고 통신인프라(-24%)가 크게 빠지며 전사 매출이 -3%로 역성장했다 — 모바일(+6%, NFC/UWB)이 차량 밖 완충 역할을 했다. S32 같은 고집적 차량 프로세서를 TSMC 5나노에 위탁하는 팹라이트로 첨단 노드 경쟁력을 확보하면서 자본 부담을 낮췄고, 성숙 노드는 자체 팹으로 원가를 지킨다. 실적이 완성차 생산·재고 사이클에 묶여 있어, 관전 포인트는 차량 재고 정상화 시점과 SDV·피지컬 AI로의 콘텐츠 증가가 매출로 전이되는 속도다. 공급단으로는 TSMC 파운드리·JCET OSAT·시높시스·케이던스 EDA에 의존하는 팹라이트 설계 노드다.","analysis_en":"The thesis is a top-three automotive position riding structural demand as electrification and SDVs raise chip content per car. But that structural demand did not materialize in FY2025: Automotive ($7.116B, 58%) stayed flat amid an inventory correction and Comms Infrastructure fell sharply (-24%), so total revenue declined -3% — with Mobile (+6%, NFC/UWB) cushioning beyond vehicles. Outsourcing high-integration processors like the S32 to TSMC 5nm (fab-lite) secures leading-edge competitiveness while lowering capital burden, and mature nodes stay in-house to protect cost. With results tied to the vehicle production/inventory cycle, the watch points are when auto inventory normalizes and how fast SDV/physical-AI content growth translates into revenue. On the supply side it is a fab-lite design node depending on TSMC foundry, JCET OSAT and Synopsys/Cadence EDA.","analysis_asof":"2026-07-09"},"edges":[{"direction":"cost","counterparty":"TSMC","counterparty_slug":"tsmc","confidence":"high","metric":null,"note":"TSMC에 첨단 차량 프로세서(S32 5나노) 파운드리 위탁 — 팹라이트 전환으로 선단 노드 경쟁력 확보.","note_en":"Outsources leading-edge auto-processor (S32, 5nm) foundry to TSMC — a fab-lite move securing leading-edge competitiveness.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-01","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=NXPI&type=10-K","title":"NXP 10-K","title_en":"NXP Form 10-K","excerpt":"TSMC에서 첨단 차량 프로세서 파운드리 매입.","excerpt_en":"Buys leading-edge auto-processor foundry from TSMC."},{"stance":"confirms","publisher":"키포스트","publisher_en":"KIPOST","kind":"news","lang":"ko","published_at":"2025-01-01","url":"https://www.kipost.net/news/articleView.html?idxno=204364","title":"NXP, 차량 프로세서에 TSMC 5나노","title_en":"NXP taps TSMC 5nm for auto processors","excerpt":"TSMC에서 첨단 차량 프로세서 파운드리 매입.","excerpt_en":"Buys leading-edge auto-processor foundry from TSMC."}]},{"direction":"revenue","counterparty":"자동차 OEM (비공개)","counterparty_slug":null,"confidence":"mid","metric":{"type":"revenue","unit":"USD","basis":"차량용 부문 매출 $71.16억(전체 58%, 전년 flat)","value":7116000000,"period":"2025","basis_en":"Automotive end-market revenue $7.116B (58% of total, flat YoY)"},"note":"자동차 OEM에 차량용 프로세서·MCU·NFC/UWB 공급 — 전동화·SDV로 대당 반도체 탑재량이 늘수록 커지는 수요.","note_en":"Supplies auto processors, MCUs and NFC/UWB to automotive OEMs — demand that grows as electrification and SDVs raise chip content per vehicle.","sources":[{"stance":"confirms","publisher":"미국 SEC 공시(EDGAR)","publisher_en":"US SEC (EDGAR)","kind":"filing","lang":"en","published_at":"2026-02-10","url":"https://www.sec.gov/Archives/edgar/data/1413447/000141344726000008/nxpi-20251231.htm","title":"NXP Semiconductors N.V. Form 10-K (FY2025)","title_en":"NXP Semiconductors N.V. Form 10-K (FY2025)","excerpt":"FY2025 10-K: 총매출 $122.69억(-3%). 차량용 $71.16억(전년 flat), 산업·IoT $22.73억, 모바일 $15.84억(+6%), 통신인프라·기타 $12.96억(-24%). GAAP 순이익 $20.21억·매출총이익률 54.7%.","excerpt_en":"FY2025 10-K: total revenue $12.269B (-3%). Automotive $7.116B (flat), Industrial & IoT $2.273B, Mobile $1.584B (+6%), Comms Infra & Other $1.296B (-24%). GAAP net income $2.021B, gross margin 54.7%."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-01","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=NXPI&type=10-K","title":"NXP 10-K","title_en":"NXP Form 10-K","excerpt":"NFC/UWB 칩을(를) 자동차 OEM에 공급.","excerpt_en":"Supplies NFC/UWB chips to automotive OEM."}]},{"direction":"revenue","counterparty":"Apple","counterparty_slug":"apple","confidence":"mid","metric":{"type":"revenue","unit":"USD","basis":"모바일 부문 매출 $15.84억(+6%), NFC/UWB 커넥티비티","value":1584000000,"period":"2025","basis_en":"Mobile end-market revenue $1.584B (+6%), NFC/UWB connectivity"},"note":"애플에 NFC/UWB 칩 공급 — 아이폰 등 모바일 커넥티비티로 차량 밖 매출을 넓히는 채널.","note_en":"Supplies NFC/UWB chips to Apple — a channel broadening revenue into mobile connectivity beyond vehicles.","sources":[{"stance":"confirms","publisher":"NXP(GlobeNewswire)","publisher_en":"NXP (GlobeNewswire)","kind":"news","lang":"en","published_at":"2026-02-02","url":"https://www.globenewswire.com/news-release/2026/02/02/3230614/0/en/NXP-Semiconductors-Reports-Fourth-Quarter-and-Full-Year-2025-Results.html","title":"NXP, 2025년 4분기·연간 실적 발표","title_en":"NXP Semiconductors Reports Fourth Quarter and Full-Year 2025 Results","excerpt":"FY2025 모바일 부문 매출 $15.84억(+6%) — NFC/UWB 커넥티비티가 차량 밖 성장을 견인.","excerpt_en":"FY2025 Mobile end-market revenue $1.584B (+6%) — NFC/UWB connectivity drove growth beyond vehicles."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-01","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=NXPI&type=10-K","title":"NXP 10-K","title_en":"NXP Form 10-K","excerpt":"Apple에 NFC/UWB 칩 공급.","excerpt_en":"Supplies NFC/UWB chips to Apple."},{"stance":"confirms","publisher":"키포스트","publisher_en":"KIPOST","kind":"news","lang":"ko","published_at":"2025-01-01","url":"https://www.kipost.net/news/articleView.html?idxno=204364","title":"NXP, 차량 프로세서에 TSMC 5나노","title_en":"NXP taps TSMC 5nm for auto processors","excerpt":"Apple에 NFC/UWB 칩 공급.","excerpt_en":"Supplies NFC/UWB chips to Apple."}]},{"direction":"cost","counterparty":"Synopsys","counterparty_slug":"synopsys","confidence":"mid","metric":null,"note":"Synopsys EDA 툴·IP 라이선스 지급.","note_en":"Pays for synopsys EDA tools and IP licenses.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-12-22","url":"https://www.sec.gov/Archives/edgar/data/883241/000088324125000028/snps-20251031.htm","title":"Synopsys FY2025 연차보고서(10-K)","title_en":"Synopsys FY2025 annual report (10-K)","excerpt":"NXP반도체가 Synopsys EDA 툴·IP 라이선스로 칩 설계.","excerpt_en":"nxp designs chips on synopsys EDA tools and IP."},{"stance":"confirms","publisher":"SemiAnalysis","publisher_en":"SemiAnalysis","kind":"research","lang":"en","published_at":"2025-09-01","url":"https://newsletter.semianalysis.com/p/eda-market-primer","title":"EDA 시장 프라이머: 과점·고객·ASIC하우스","title_en":"EDA Market Primer","excerpt":"NXP반도체가 Synopsys EDA 툴·IP 라이선스로 칩 설계.","excerpt_en":"nxp designs chips on synopsys EDA tools and IP."}]},{"direction":"cost","counterparty":"Cadence Design Systems","counterparty_slug":"cadence","confidence":"mid","metric":null,"note":"Cadence Design Systems EDA 툴·IP 라이선스 지급.","note_en":"Pays for cadence EDA tools and IP licenses.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-19","url":"https://www.sec.gov/Archives/edgar/data/813672/000081367226000016/cdns-20251231.htm","title":"Cadence FY2025 연차보고서(10-K)","title_en":"Cadence FY2025 annual report (10-K)","excerpt":"NXP반도체가 Cadence Design Systems EDA 툴·IP 라이선스로 칩 설계.","excerpt_en":"nxp designs chips on cadence EDA tools and IP."},{"stance":"confirms","publisher":"SemiAnalysis","publisher_en":"SemiAnalysis","kind":"research","lang":"en","published_at":"2025-09-01","url":"https://newsletter.semianalysis.com/p/eda-market-primer","title":"EDA 시장 프라이머: 과점·고객·ASIC하우스","title_en":"EDA Market Primer","excerpt":"NXP반도체가 Cadence Design Systems EDA 툴·IP 라이선스로 칩 설계.","excerpt_en":"nxp designs chips on cadence EDA tools and IP."}]},{"direction":"cost","counterparty":"JCET","counterparty_slug":"jcet","confidence":"mid","metric":null,"note":"JCET 등 OSAT에 후공정 조립·테스트 위탁 — 팹라이트 구조의 후공정 사슬.","note_en":"Outsources back-end assembly/test to OSATs like JCET — the back-end leg of its fab-lite structure.","sources":[{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"analysis","lang":"en","published_at":"2025-05-13","url":"https://www.trendforce.com/presscenter/news/20250513-12577.html","title":"2024 OSAT 톱10(PTI 5위)","title_en":"Top 10 OSAT 2024 (PTI No.5)","excerpt":"JCET에서 후공정 조립·테스트 이용.","excerpt_en":"Uses assembly and test from JCET."},{"stance":"confirms","publisher":"JCET","publisher_en":"JCET","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.jcetglobal.com/en/","title":"JCET IR","title_en":"JCET IR","excerpt":"JCET에서 후공정 조립·테스트 이용.","excerpt_en":"Uses assembly and test from JCET."}]},{"direction":"cost","counterparty":"자체 fab 장비·소재 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"제조용 부품·소재·R&D(비공개).","note_en":"Parts, materials and R&D (undisclosed).","sources":[{"stance":"mentions","publisher":"미국 SEC 공시(EDGAR)","publisher_en":"US SEC (EDGAR)","kind":"filing","lang":"en","published_at":"2026-02-10","url":"https://www.sec.gov/Archives/edgar/data/1413447/000141344726000008/nxpi-20251231.htm","title":"NXP Semiconductors N.V. Form 10-K (FY2025)","title_en":"NXP Semiconductors N.V. Form 10-K (FY2025)","excerpt":"FY2025 10-K: 자체 팹·성숙노드 제조와 R&D 비용 구조(개별 장비·소재 공급사 비중 비공개).","excerpt_en":"FY2025 10-K: in-house fab / mature-node manufacturing and R&D cost structure (individual equipment/material supplier shares undisclosed)."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-01","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=NXPI&type=10-K","title":"NXP 10-K","title_en":"NXP Form 10-K","excerpt":"제조용 부품·소재·R&D(비공개).","excerpt_en":"Parts, materials and R&D (undisclosed)."}]}]}