# Who does Broadcom pay? Who are its key suppliers? Canonical: https://valuechain.wiki/broadcom · Facet: suppliers · Updated: 2026-09-23T08:29:48.764779+00:00 · Source: ValueChain.wiki (cited money-flow graph) **Citable summary**: Broadcom's confirmed suppliers/cost counterparties include TSMC, SK하이닉스, Synopsys plus 9 undisclosed/aggregate relationships. Per the valuechain.wiki graph: 12 cost edges, backed by 21 dated sources, 6 of them primary filings (as of 2026-09-23). ### TSMC (high) → /tsmc.md - note: Wafer foundry for TPU and custom AI chips; most front-end is outsourced. - [confirms] SEC EDGAR (EN, filing, published 2025-12-18) https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm: "Broadcom 10-K: outsources the majority of front-end wafer manufacturing to external foundries including TSMC." - [confirms] Digital Daily (KO, news, published 2025-12-01) https://m.ddaily.co.kr/page/view/2025120111290617700: "TSMC manufactures the TPU co-designed by Google and Broadcom." ### SK하이닉스 (high) → /sk-hynix.md - note: Buys HBM at large scale for custom AI accelerators. - [confirms] ZDNet Korea (KO, news, published 2026-03-05) https://zdnet.co.kr/view/?no=20260305121446: "Broadcom's AI chip growth drives Samsung and SK HBM demand." - [confirms] TheElec (KO, news, published 2025-05-20) https://www.thelec.kr/news/articleView.html?idxno=31843: "SK hynix supplies HBM to Broadcom at large scale." ### Synopsys (high) → /synopsys.md - note: Uses/buys EDA tools and IP from Synopsys. - [confirms] SemiAnalysis (EN, research, published 2025-09-01) https://newsletter.semianalysis.com/p/eda-market-primer: "Synopsys leads EDA at ~31%." - [confirms] Seoul Economic Daily (KO, news, published 2025-07-01) https://www.sedaily.com/NewsView/2GVCJ4DVZD: "Samsung and others use Synopsys EDA." - [confirms] SEC EDGAR (EN, filing, published 2024-12-18) https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=SNPS&type=10-K: "10-K: EDA tools/IP revenue and major chip customers." ### Cadence Design Systems (high) → /cadence.md - note: Uses/buys EDA tools and IP from Cadence Design Systems. - [confirms] SemiAnalysis (EN, research, published 2025-09-01) https://newsletter.semianalysis.com/p/eda-market-primer: "Cadence is No.2 in EDA at ~30%." - [confirms] Seoul Economic Daily (KO, news, published 2025-03-01) https://www.sedaily.com/article/14136879: "Cadence grows on AI-chip design." - [confirms] SEC EDGAR (EN, filing, published 2025-02-24) https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=CDNS&type=10-K: "10-K: EDA tools/IP revenue." ### 삼성전자 (mid) → /samsung-electronics.md - note: HBM supplier for AI accelerators. - [confirms] Seoul Economic Daily (KO, news, published 2026-03-06) https://www.sedaily.com/article/14157561: "Broadcom's AI revenue surge opens a door for Samsung HBM." ### Micron Technology (mid) → /micron.md - note: HBM supplier for AI accelerators. - [mentions] ZDNet Korea (KO, news, published 2026-03-05) https://zdnet.co.kr/view/?no=20260305121446: "Demand for Samsung, SK and Micron HBM expands with Broadcom's AI chips." ### Siemens EDA (mid) → /siemens-eda.md - note: Pays for Siemens EDA (Calibre etc.) licenses. - [confirms] Wikipedia (KO, news, published 2026-01-01) https://ko.wikipedia.org/wiki/멘토_그래픽스: "broadcom designs chips on Siemens EDA (Calibre/Tessent/Questa)." - [confirms] SemiWiki (EN, research, published 2025-06-01) https://semiwiki.com/wikis/company-wikis/mentor-graphics-wiki/: "broadcom designs chips on Siemens EDA (Calibre/Tessent/Questa)." ### 삼성전기 (mid) → /samsung-electro-mechanics.md - note: Sources advanced AI-accelerator FC-BGA from Samsung Electro-Mechanics from 2H 2026. - [mentions] DART (FSS Electronic Disclosure) (KO, filing, published 2026-03-10) https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310003071: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T." - [confirms] TheElec (KO, news, published 2026-01-31) https://www.thelec.kr/news/articleView.html?idxno=51302: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates." ### UMC (mid) → /umc.md - note: Fabricates some communications/specialty chips at UMC mature nodes. - [mentions] SMBOM (EN, news, accessed 2026-06-20) https://www.smbom.com/news/40403: "Broadcom is a UMC foundry customer." ### Arm Holdings (mid) → /arm.md - note: Uses/buys CPU-architecture IP (license and royalty) from Arm Holdings. - [confirms] Economy6 (KO, news, published 2026-01-15) https://www.economy6.com/2026/01/arm-stock.html: "Apple, Qualcomm, Samsung, NVIDIA use ARM IP." - [confirms] Arm IR (EN, ir, published 2024-07-01) https://investors.arm.com/static-files/219a3b28-f209-4d74-8bc6-f9e026d55a95: "FY2024 revenue $3.23B." - [confirms] SEC EDGAR (EN, filing, published 2024-05-22) https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=ARM&type=20-F: "20-F: licensing and royalty revenue." ### Keysight (mid) → /keysight.md - note: Uses Keysight test to validate 800G Ethernet silicon. - [confirms] Converge Digest (EN, news, published 2025-01-01) https://convergedigest.com/keysight-broadcom-validate-800g-ultra-ethernet/: "Uses Keysight test to validate 800G Ethernet silicon." ### TOPPAN (FC-BGA 반도체 패키지 기판) (mid) → /toppan-printing.md - note: Co-produces FC-BGA substrates for AI/networking chips with Toppan — a new Singapore plant secures upstream supply of advanced package substrates. - [confirms] TOPPAN Holdings (TDnet financial results) (JA, filing, published 2026-05-14) https://japanir.jp/wp-content/uploads/2026/05/7911-20260514-01.pdf: "Broadcom and Toppan co-produce FC-BGA substrates at a new Singapore plant." - [confirms] TOPPAN (EN, news, published 2025-06-01) https://www.toppan.com/en/electronics/package/fc-bga/: "Broadcom and Toppan co-produce FC-BGA substrates at a new Singapore plant." Reverse side: https://valuechain.wiki/broadcom/customers.md · Ripple: https://valuechain.wiki/broadcom/ripple.md --- Full node: https://valuechain.wiki/broadcom.md · JSON: https://valuechain.wiki/broadcom.json