# Who are ASMPT's customers? Who does ASMPT earn revenue from?
Canonical: https://valuechain.wiki/asmpt · Facet: customers · Updated: 2026-07-12T08:28:56.762+00:00 · Source: ValueChain.wiki (cited money-flow graph)

**Citable summary**: ASMPT's confirmed revenue counterparties include SK하이닉스, 앰코테크놀로지, 삼성전자 plus 1 undisclosed/aggregate relationship. Per the valuechain.wiki graph: 4 revenue edges, backed by 8 dated sources, 2 of them primary filings (as of 2026-07-12).

### SK하이닉스 (high)  → /sk-hynix.md
- metric: Supply share ~50% · HBM4 2026 · SK HBM4 TC bonder orders
- note: The core buyer of SK Hynix HBM4 TC bonders — about half of current order volume, shared with Hanmi. The HBM4 ramp is the direct engine of ASMPT's growth.
- [mentions] ASMPT / Analyst (EN, research, published 2026-03-04) https://www.asmpt.com/en/investor-relations/news-events/asmpt-announces-2025-annual-results/: "ASMPT FY2025 revenue HK$14.52bn (+9.8%), bookings HK$14.98bn (+17.5%). Advanced Packaging $532M (+30.2%) and TCB equipment revenue +146%, a record. TCB market $760M (2025) → $1.6B (2028), ~30% CAGR. Analyst Buy, HK$122 target."
- [confirms] TrendForce (EN, news, published 2025-12-12) https://www.trendforce.com/news/2025/12/12/news-sk-hynix-reportedly-places-hbm4-tc-bonder-order-with-asmpt-as-hanmi-hanwha-patent-clash-heats-up/: "TrendForce: SK hynix ordered HBM4 TC bonders from ASMPT, split with Hanmi."
- [confirms] TheElec (KO, news, published 2025-09-10) https://www.thelec.kr/news/articleView.html?idxno=45188: "SK hynix placed a new order with ASMPT for 7 HBM4 TC bonders (about ₩300B)."
- [confirms] ASMPT / HKEX (EN, filing, published 2025-02-28) https://www.asmpt.com/site/assets/files/76526/e0522_results_announcement_2024_q4.pdf: "2024 results: record TCB revenue and bookings, HBM breakthrough (Q4 bulk order); AP revenue +23% to ~$505M."

### 앰코테크놀로지 (mid)  → /amkor.md
- note: OSAT Amkor sources back-end packaging tools — tied to advanced-packaging capacity expansion.
- [mentions] Amkor Technology IR (EN, ir, accessed 2026-06-20) https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced: "Amkor is a customer buying back-end equipment and substrates."

### 삼성전자 (mid)  → /samsung-electronics.md
- note: Samsung's HBM lines source TC bonders — a demand point that keeps both memory leaders as customers.
- [confirms] ZDNet Korea (KO, news, published 2026-04-13) https://zdnet.co.kr/view/?no=20260413092559: "Samsung Electronics plans to run a JEP (Joint Evaluation Project) with Singapore-headquartered ASMPT on TC bonders for HBM."
- [mentions] The Korea Economic Daily (KO, news, published 2026-01-21) https://www.hankyung.com/article/2026012147281: "Samsung Electronics is reportedly in discussions with Singapore-based ASMPT to expand its pool of TC bonder suppliers."

### ASE테크놀로지 (mid)  → /ase.md
- note: ASE, the largest OSAT, sources packaging tools — a large demand point in the OSAT capacity cycle.
- [mentions] SEC EDGAR (EN, filing, published 2026-04-01) https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm: "ASE is a customer buying back-end equipment."

Reverse side: https://valuechain.wiki/asmpt/suppliers.md · Ripple: https://valuechain.wiki/asmpt/ripple.md

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Full node: https://valuechain.wiki/asmpt.md · JSON: https://valuechain.wiki/asmpt.json