{"slug":"amkor","name":"앰코테크놀로지","name_en":"Amkor Technology","ticker":"AMKR","updated_at":"2026-07-12T08:28:56.762+00:00","canonical":"https://valuechain.wiki/amkor","same_as":["https://finance.yahoo.com/quote/AMKR","https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=1047127"],"citable":"밸류체인 그래프 기준 앰코테크놀로지의 직접 연결 기업은 9곳(관계 기준 공급 8·매출 1)이고, 사슬을 2차까지 넓히면 12곳에 닿는다. 링크의 근거 출처는 15건이며 그중 1차공시가 4건이다 (valuechain.wiki, 2026-07-12 기준).","citable_en":"Per the valuechain.wiki graph, Amkor Technology is directly linked to 9 companies (8 supply, 1 revenue relationships) and reaches 12 companies within two hops; the links are backed by 15 dated sources, 4 of them primary filings (as of 2026-07-12).","kicker":"OSAT (후공정 패키징·테스트)","kicker_en":"OSAT (packaging & test)","lead":"미국 본사 최대 OSAT(후공정 패키징·테스트). FY2025 매출 $6.7B. 최대 고객은 애플로 10년 넘게 칩을 패키징해 왔고, TSMC가 만든 애플 실리콘을 애리조나 신캠퍼스($7B)에서 패키징할 예정. 패키징 장비는 ASMPT·BESI, 기판은 삼성전기 등에서 매입.","lead_en":"The largest US-headquartered OSAT (outsourced packaging and test). FY2025 revenue $6.7B. Its largest customer is Apple, whose chips it has packaged for over a decade; its $7B Arizona campus will package Apple silicon made at TSMC. 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It has packaged the chips of its largest customer Apple for over a decade and will package TSMC-made Apple silicon and NVIDIA at its $7B Arizona campus, standing at the gateway of US advanced packaging. In a bottleneck where fabless/IDM volumes flow into back-end utilization, the supply side (equipment makers) moved harder and earlier than the stock — FY2025 revenue $6.7B. In the graph it depends upstream on ASMPT, BESI, K&S, Disco and Camtek (tools) and Samsung Electro-Mechanics and Resonac (substrates/materials), selling packaging downstream to Apple, NVIDIA and others. The keys are the advanced-packaging ramp (flip-chip, hybrid bonding) and Arizona start-up; the risks are Apple single-customer concentration and capex payback.","analysis_asof":"2026-07-09"},"edges":[{"direction":"revenue","counterparty":"팹리스·IDM 고객 (NVIDIA 등)","counterparty_slug":null,"confidence":"high","metric":{"type":"revenue","unit":"USD","basis":"연간 총매출","value":6700000000,"period":"FY2025","basis_en":"annual total revenue"},"note":"NVIDIA 등 팹리스·IDM의 칩을 패키징·테스트(FY2025 매출 $6.7B, 애리조나 캠퍼스 포함) — 이들이 늘리는 AI 칩 물량이 앰코 후공정 가동률로 직결되는 병목 수요다.","note_en":"Packages and tests chips for fabless/IDM customers such as NVIDIA (FY2025 revenue $6.7B, incl. the Arizona campus) — the AI-chip volumes they add flow directly into Amkor's back-end utilization, the bottleneck demand.","sources":[{"stance":"mentions","publisher":"애널리스트 컨센서스","publisher_en":"Analyst consensus","kind":"research","lang":"en","published_at":"2026-06-29","url":"https://www.marketbeat.com/stocks/NASDAQ/AMKR/forecast/","title":"앰코테크놀로지(AMKR) 애널리스트: Buy 컨센서스, 첨단패키징 AI 수요 (목표가 $78~82.5)","title_en":"Amkor (AMKR) analysts: Buy consensus, AI advanced-packaging demand (target $78-82.5)","excerpt":"애널리스트 8인 Buy 컨센서스(목표가 중앙값 $82.5, 범위 $60~90). Q4'25·Q1'26 4개 분기 연속 어닝 서프라이즈, 첨단패키징이 견인. 2026 컴퓨팅 사업 +20%+ 성장 전망(FY2025 매출 $6.7B).","excerpt_en":"8 analysts Buy consensus (median target $82.5, range $60-90). Four straight earnings beats through Q4'25/Q1'26, driven by advanced packaging. 2026 computing business expected to grow 20%+ (FY2025 revenue $6.7B)."},{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"FY2025 매출 $6.7B.","excerpt_en":"FY2025 revenue $6.7B."},{"stance":"mentions","publisher":"앰코테크놀로지 IR","publisher_en":"Amkor Technology IR","kind":"ir","lang":"en","published_at":null,"url":"https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced","title":"앰코, 애리조나 $7B 패키징 캠퍼스 착공 (애플 최대고객)","title_en":"Amkor breaks ground on $7B Arizona packaging campus (Apple largest customer)","excerpt":"애리조나 캠퍼스가 애플·NVIDIA를 지원.","excerpt_en":"Arizona campus to support Apple and Nvidia."}]},{"direction":"cost","counterparty":"Kulicke & Soffa","counterparty_slug":"kulicke-soffa","confidence":"high","metric":{"type":"advanced_packaging_equipment","qualifier":"confirmed_no_disclosed_value"},"note":"Kulicke & Soffa에서 본딩 장비 매입.","note_en":"Buys bonding equipment from Kulicke & Soffa.","sources":[{"stance":"confirms","publisher":"Business Research Insights","publisher_en":"BRI","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.businessresearchinsights.com/market-reports/tcb-bonder-market-100089","title":"TCB 본더 시장(K&S·ASMPT·Besi 50%)","title_en":"TCB bonder market","excerpt":"Kulicke & Soffa에서 본딩 장비 매입.","excerpt_en":"Buys bonding equipment from Kulicke & Soffa."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2024-11-14","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=KLIC&type=10-K","title":"Kulicke & Soffa 10-K","title_en":"Kulicke & Soffa Form 10-K","excerpt":"Kulicke & Soffa에서 본딩 장비 매입.","excerpt_en":"Buys bonding equipment from Kulicke & Soffa."}]},{"direction":"revenue","counterparty":"Apple","counterparty_slug":"apple","confidence":"high","metric":{"type":"qualifier","basis":"최대 고객(애플)","value":null,"period":"2025","basis_en":"largest customer (Apple)","qualifier":"sole_source"},"note":"앰코의 첫·최대 고객으로 10년 넘게 애플 칩을 패키징 — 애리조나 $7B 캠퍼스에서 TSMC 생산 애플 실리콘을 패키징할 예정이라, 애플 물량이 앰코 미국 첨단 패키징의 앵커이자 단일 고객 집중 리스크의 핵심이다.","note_en":"Amkor's first and largest customer, packaging Apple chips for over a decade — with the $7B Arizona campus set to package TSMC-made Apple silicon, Apple volume is the anchor of Amkor's US advanced packaging and the core of its single-customer concentration risk.","sources":[{"stance":"confirms","publisher":"전자신문","publisher_en":"Electronic Times","kind":"news","lang":"ko","published_at":"2025-11-19","url":"https://www.etnews.com/20251119000390","title":"앰코코리아, 송도에 2700억 투자…AI 반도체 패키징","title_en":"Amkor Korea invests ₩270B in Songdo for AI chip packaging","excerpt":"앰코 송도 K5가 애플 칩 후공정 담당, AI 패키징 투자 확대.","excerpt_en":"Amkor’s Songdo K5 handles Apple chip back-end; expanding AI packaging investment."},{"stance":"confirms","publisher":"디지타임스","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2023-12-01","url":"https://www.digitimes.com/news/a20231201VL201/amkor-advanced-packaging-us-apple.html","title":"앰코 미국 첨단 패키징, 애플이 첫 고객","title_en":"Amkor US advanced packaging, Apple to be first customer","excerpt":"애플이 앰코 미국 첨단 패키징의 첫 고객.","excerpt_en":"Apple to be the first customer of Amkor’s US advanced packaging."},{"stance":"confirms","publisher":"앰코테크놀로지 IR","publisher_en":"Amkor Technology IR","kind":"ir","lang":"en","published_at":null,"url":"https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced","title":"앰코, 애리조나 $7B 패키징 캠퍼스 착공 (애플 최대고객)","title_en":"Amkor breaks ground on $7B Arizona packaging campus (Apple largest customer)","excerpt":"애플이 앰코의 첫·최대 고객.","excerpt_en":"Apple is Amkor’s first and largest customer."}]},{"direction":"cost","counterparty":"코후","counterparty_slug":"cohu","confidence":"mid","metric":{"type":"advanced_packaging_equipment","qualifier":"confirmed_no_disclosed_value"},"note":"코후에서 테스트 핸들러·인터페이스 매입.","note_en":"Purchases test handlers and interfaces from Cohu.","sources":[{"stance":"confirms","publisher":"Cohu Inc (SEC 10-K)","publisher_en":"Cohu Inc (SEC 10-K)","kind":"filing","lang":"en","published_at":"2026-02-17","url":"https://www.sec.gov/Archives/edgar/data/21535/000143774926004339/cohu20251227_10k.htm","title":"Cohu 10-K (FY2025)","title_en":"Cohu Inc — Form 10-K (FY2025)","excerpt":"코후에서 테스트 핸들러·인터페이스 매입.","excerpt_en":"Buys test handlers and interfaces from Cohu."},{"stance":"confirms","publisher":"Mordor Intelligence","publisher_en":"Mordor","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.mordorintelligence.com/industry-reports/semiconductor-test-equipment-market","title":"테스트 장비 시장(Advantest·Teradyne·Cohu 55%)","title_en":"Test equipment market","excerpt":"코후에서 테스트 핸들러·인터페이스 매입.","excerpt_en":"Buys test handlers and interfaces from Cohu."}]},{"direction":"cost","counterparty":"Camtek","counterparty_slug":"camtek","confidence":"mid","metric":{"type":"advanced_packaging_equipment","qualifier":"confirmed_no_disclosed_value"},"note":"Camtek에서 검사·계측 장비 매입.","note_en":"Buys inspection and metrology tools from Camtek.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-03-01","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=CAMT&type=20-F","title":"Camtek 연차보고서","title_en":"Camtek annual report (SEC)","excerpt":"Camtek에서 검사·계측 장비 매입.","excerpt_en":"Buys inspection and metrology tools from Camtek."},{"stance":"confirms","publisher":"디일렉","publisher_en":"TheElec","kind":"news","lang":"ko","published_at":"2025-01-01","url":"https://www.thelec.kr/news/articleView.html?idxno=31137","title":"캠텍, HBM 16단 테스터 한국 공개","title_en":"Camtek unveils HBM 16-hi tester in Korea","excerpt":"Camtek에서 검사·계측 장비 매입.","excerpt_en":"Buys inspection and metrology tools from Camtek."}]},{"direction":"cost","counterparty":"Resonac","counterparty_slug":"resonac","confidence":"mid","metric":{"type":"packaging_material","qualifier":"confirmed_no_disclosed_value"},"note":"Resonac에서 패키징 소재 매입.","note_en":"Buys packaging materials from Resonac.","sources":[{"stance":"confirms","publisher":"레조낙","publisher_en":"Resonac","kind":"news","lang":"en","published_at":"2025-12-01","url":"https://www.resonac.com/news/2025/12/01/3669.html","title":"Resonac, TSMC 우수성과상 수상","title_en":"Resonac wins TSMC Excellent Performance Award","excerpt":"Resonac에서 패키징 소재 매입.","excerpt_en":"Buys packaging materials from Resonac."},{"stance":"confirms","publisher":"레조낙","publisher_en":"Resonac","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.resonac.com/investors","title":"Resonac IR","title_en":"Resonac IR","excerpt":"Resonac에서 패키징 소재 매입.","excerpt_en":"Buys packaging materials from Resonac."}]},{"direction":"cost","counterparty":"BESI","counterparty_slug":"besi","confidence":"mid","metric":{"type":"advanced_packaging_equipment","qualifier":"confirmed_no_disclosed_value"},"note":"다이 어태치·하이브리드 본딩 장비를 BESI에서 매입.","note_en":"Buys die-attach and hybrid-bonding tools from BESI.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 후공정 장비·기판을 주요 공급사에서 매입.","excerpt_en":"10-K: buys back-end equipment and substrates from key suppliers."}]},{"direction":"cost","counterparty":"삼성전기","counterparty_slug":"samsung-electro-mechanics","confidence":"mid","metric":{"type":"packaging_material","qualifier":"confirmed_no_disclosed_value"},"note":"패키지 기판(FC-BGA 등)을 삼성전기 등에서 매입.","note_en":"Buys package substrates (FC-BGA, etc.) from suppliers such as Samsung Electro-Mechanics.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 후공정 장비·기판을 주요 공급사에서 매입.","excerpt_en":"10-K: buys back-end equipment and substrates from key suppliers."}]},{"direction":"cost","counterparty":"디스코","counterparty_slug":"disco","confidence":"mid","metric":{"type":"advanced_packaging_equipment","qualifier":"confirmed_no_disclosed_value"},"note":"디스코에서 다이싱·그라인딩 장비 매입.","note_en":"Purchases dicing and grinding equipment from Disco.","sources":[{"stance":"confirms","publisher":"디스코","publisher_en":"Disco","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.disco.co.jp/eg/ir/","title":"Disco IR","title_en":"Disco IR","excerpt":"디스코에서 다이싱·그라인딩 장비 매입.","excerpt_en":"Buys dicing and grinding equipment from Disco Corporation."},{"stance":"confirms","publisher":"SemiAnalysis","publisher_en":"SemiAnalysis","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://newsletter.semianalysis.com/p/disco-corporation-the-world-leader","title":"Disco, 다이싱·그라인딩 세계 1위","title_en":"Disco, world leader in dicing/grinding","excerpt":"디스코에서 다이싱·그라인딩 장비 매입.","excerpt_en":"Buys dicing and grinding equipment from Disco Corporation."}]},{"direction":"cost","counterparty":"ASMPT","counterparty_slug":"asmpt","confidence":"mid","metric":{"type":"advanced_packaging_equipment","qualifier":"confirmed_no_disclosed_value"},"note":"다이·와이어 본더 등 후공정 패키징 장비를 ASMPT에서 매입 — 첨단 패키징 램프의 실행이 이 장비 리드타임에 걸린 상류 제약으로, OSAT 병목의 원가측이다.","note_en":"Buys die/wire bonders and back-end packaging tools from ASMPT — the advanced-packaging ramp's execution hinges on this tool lead time, an upstream constraint and the cost side of the OSAT bottleneck.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 후공정 장비·기판을 주요 공급사에서 매입.","excerpt_en":"10-K: buys back-end equipment and substrates from key suppliers."}]},{"direction":"cost","counterparty":"리드프레임·소재 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"리드프레임·본딩와이어·몰딩 소재 매입(공급사 비공개).","note_en":"Buys leadframes, bonding wire and molding materials (suppliers undisclosed).","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 패키징 소재 공급망 의존.","excerpt_en":"10-K: depends on packaging-materials supply."}]}]}