# Who does AMD pay? Who are its key suppliers?
Canonical: https://valuechain.wiki/amd · Facet: suppliers · Updated: 2026-07-12T08:20:40.904419+00:00 · Source: ValueChain.wiki (cited money-flow graph)

**Citable summary**: AMD's confirmed suppliers/cost counterparties include TSMC, 삼성전자, Micron Technology plus 14 undisclosed/aggregate relationships. Per the valuechain.wiki graph: 17 cost edges, backed by 28 dated sources, 4 of them primary filings (as of 2026-07-12).

### TSMC (high)  → /tsmc.md
- note: MI350 XCDs are made on TSMC's N3P node (foundry).
- [confirms] SEC EDGAR (EN, filing, published 2026-02-04) https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm: "AMD 10-K: utilizes TSMC for wafer production of HPC, FPGA and adaptive SoC products."
- [confirms] TrendForce (EN, news, published 2025-06-13) https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/: "MI350X/MI355X are built on TSMC's N3P node."

### 삼성전자 (high)  → /samsung-electronics.md
- note: HBM3E 12-high supplier for MI350 plus some foundry. Supplying since June 2025.
- [confirms] Korea Economic Daily (KO, news, published 2025-06-13) https://www.hankyung.com/article/202506133500i: "Samsung supplies 12-high HBM3E to AMD's MI350 from June 2025."
- [confirms] TrendForce (EN, news, published 2025-06-13) https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/: "MI350 uses Samsung and Micron as dual HBM3E suppliers."

### Micron Technology (high)  → /micron.md
- note: HBM3E 36GB supplier for MI350 (dual with Samsung).
- [confirms] TrendForce (EN, news, published 2025-06-13) https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/: "MI350's 288GB HBM3E comes from Micron and Samsung."
- [mentions] AMD (EN, ir, published 2025-06-12) https://ir.amd.com/news-events/press-releases/detail/1201/amd-accelerates-pace-of-data-center-ai-innovation-and-leadership-with-expanded-amd-instinct-gpu-roadmap: "MI350 series carries 288GB HBM3E."

### AT&S (high)  → /at-s.md
- note: Uses high-end IC substrates from AT&S.
- [confirms] AT&S (EN, ir, published 2025-05-01) https://ams.at-s.com/: "Uses high-end IC substrates from AT&S."
- [confirms] IMR (EN, analysis, published 2025-01-01) https://www.intelmarketresearch.com/global-package-substrates-forecast-market-27111: "Uses high-end IC substrates from AT&S."

### Synopsys (high)  → /synopsys.md
- note: Uses/buys EDA tools and IP from Synopsys.
- [confirms] SemiAnalysis (EN, research, published 2025-09-01) https://newsletter.semianalysis.com/p/eda-market-primer: "Synopsys leads EDA at ~31%."
- [confirms] Seoul Economic Daily (KO, news, published 2025-07-01) https://www.sedaily.com/NewsView/2GVCJ4DVZD: "Samsung and others use Synopsys EDA."
- [confirms] SEC EDGAR (EN, filing, published 2024-12-18) https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=SNPS&type=10-K: "10-K: EDA tools/IP revenue and major chip customers."

### Cadence Design Systems (high)  → /cadence.md
- note: Uses/buys EDA tools and IP from Cadence Design Systems.
- [confirms] SemiAnalysis (EN, research, published 2025-09-01) https://newsletter.semianalysis.com/p/eda-market-primer: "Cadence is No.2 in EDA at ~30%."
- [confirms] Seoul Economic Daily (KO, news, published 2025-03-01) https://www.sedaily.com/article/14136879: "Cadence grows on AI-chip design."
- [confirms] SEC EDGAR (EN, filing, published 2025-02-24) https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=CDNS&type=10-K: "10-K: EDA tools/IP revenue."

### Arteris (high)  → /arteris.md
- note: Licenses Arteris NoC IP for chiplet data transport.
- [confirms] BriefGlance (EN, news, published 2026-01-01) https://briefglance.com/companies/arteris-inc/pulses/23658: "Licenses Arteris NoC IP for chiplet data transport."

### 글로벌파운드리 (mid)  → /globalfoundries.md
- note: Foundry for certain products.
- [confirms] SEC EDGAR (EN, filing, published 2026-02-04) https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm: "AMD 10-K: also utilizes GLOBALFOUNDRIES as a foundry."

### 삼성전기 (mid)  → /samsung-electro-mechanics.md
- note: Buys FC-BGA semiconductor substrates for AI accelerators.
- [confirms] TheElec (KO, news, published 2026-01-31) https://www.thelec.kr/news/articleView.html?idxno=51302: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."

### SK하이닉스 (mid)  → /sk-hynix.md
- note: Buys HBM3E for its AI accelerators (MI300/MI350) from SK hynix (one of its suppliers).
- [mentions] Notebookcheck (EN, news, accessed 2026-06-19) https://www.notebookcheck.net/SK-hynix-sells-out-its-DRAM-NAND-and-HBM-chip-supply-to-Nvidia-through-2026-as-AI-demand-outpaces-Samsung-and-Micron-s-capacity.1151402.0.html: "Supplies HBM to global AI customers such as NVIDIA and Google."

### ASE테크놀로지 (mid)  → /ase.md
- note: Outsources full-process packaging of Venice CPUs to ASE (from 2026).
- [confirms] TrendForce (EN, news, published 2026-01-14) https://www.trendforce.com/news/2026/01/14/news-ase-buys-nt2-8b-zhunan-facility-packaging-orders-reportedly-span-nvidia-amd-and-more/: "AMD Venice to use ASE full-process packaging."

### 신코덴키 (mid)  → /shinko.md
- note: Uses FC-BGA package substrates from Shinko Electric.
- [confirms] Shinko (EN, ir, published 2025-05-01) https://www.shinko.co.jp/english/: "Uses FC-BGA package substrates from Shinko Electric Industries."
- [confirms] MGR (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "Uses FC-BGA package substrates from Shinko Electric Industries."

### Arm Holdings (mid)  → /arm.md
- note: Uses/buys CPU-architecture IP (license and royalty) from Arm Holdings.
- [confirms] Economy6 (KO, news, published 2026-01-15) https://www.economy6.com/2026/01/arm-stock.html: "Apple, Qualcomm, Samsung, NVIDIA use ARM IP."
- [confirms] Arm IR (EN, ir, published 2024-07-01) https://investors.arm.com/static-files/219a3b28-f209-4d74-8bc6-f9e026d55a95: "FY2024 revenue $3.23B."
- [confirms] SEC EDGAR (EN, filing, published 2024-05-22) https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=ARM&type=20-F: "20-F: licensing and royalty revenue."

### Ibiden (mid)  → /ibiden.md
- note: Buys FC-BGA package substrates from Ibiden.
- [confirms] Jabon (KO, news, published 2026-02-01) https://www.jabon.co.kr/news/articleView.html?idxno=926: "¥500B expansion for NVIDIA AI substrates."
- [confirms] Ibiden (EN, ir, published 2025-05-01) https://www.ibiden.com/ir/: "IR: IC package-substrate revenue."
- [confirms] DigiTimes (EN, news, published 2025-01-02) https://www.digitimes.com/news/a20250102PD221/ibiden-ic-substrate-demand-market-intel-nvidia.html: "Exclusive FC-BGA supply to Intel and NVIDIA."

### Monolithic Power (mid)  → /monolithic-power.md
- note: Supplies the power-delivery network (multiple rails) for AMD's Instinct MI300 GPU, extending its AI-accelerator power wins from NVIDIA H100 to AMD.
- [confirms] SemiAnalysis (EN, research, published 2023-08-01) https://newsletter.semianalysis.com/p/energizing-ai-power-delivery-competition: "Monolithic Power Systems was able to supplant Vicor in Nvidia's H100 GPU."
- [confirms] The Razor's Edge (EN, research, published 2023-06-27) https://the-razors-edge.ghost.io/vicor-short-thesis-ai-chip-mania-accelerates-vicors-competitive-demise-provides-an-asymmetric-short-opportunity/: "these are all parts that AMD will be buying from MPS."

### Siemens EDA (mid)  → /siemens-eda.md
- note: Pays for Siemens EDA (Calibre etc.) licenses.
- [confirms] Wikipedia (KO, news, published 2026-01-01) https://ko.wikipedia.org/wiki/멘토_그래픽스: "amd designs chips on Siemens EDA (Calibre/Tessent/Questa)."
- [confirms] SemiWiki (EN, research, published 2025-06-01) https://semiwiki.com/wikis/company-wikis/mentor-graphics-wiki/: "amd designs chips on Siemens EDA (Calibre/Tessent/Questa)."

### 유니마이크론 (mid)  → /unimicron.md
- note: Uses FC-BGA and IC package substrates from Unimicron.
- [confirms] Unimicron (EN, ir, published 2025-05-01) https://www.unimicron.com/en/: "Uses FC-BGA/IC package substrates from Unimicron."
- [confirms] MGR (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "Uses FC-BGA/IC package substrates from Unimicron."

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