# AMD (AMD)
> NVIDIA의 주요 경쟁자. FY2025 매출 $34.6B(+34%, 데이터센터 $16.6B), FY26 Q1 데이터센터 $5.8B(+57%)로 MI350 본격 램프. Instinct MI350(HBM3E 288GB)을 Microsoft·Meta·Oracle·OpenAI에 공급. 칩은 TSMC(N3P)·GlobalFoundries에 위탁, HBM은 삼성·마이크론에서 매입.
Canonical: https://valuechain.wiki/amd · Updated: 2026-06-20 · Source: ValueChain.wiki (refined facts, cited)

## Financials & segments
- 총매출: $34.6B (FY2025, +34%); FY26 Q1 매출 $10.3B(+38%), 데이터센터 $5.8B(+57%)
- 고객 집중도: 단일고객 10%↑ 없음(FY2025, 분산). 데이터센터 FY2025 $16.6B → FY26 Q1 $5.8B, Q2 가이던스 전사 $11.2B
- 사업부문: 데이터센터($16.6B), 클라이언트+게이밍($14.6B), 임베디드($3.5B)

## Money in · revenue from (4)
### Oracle (high)
- metric: 수량 50,000 · 2026 · MI450 슈퍼클러스터
- note: MI450 5만대 슈퍼클러스터 제공(첫 하이퍼스케일러).
- [confirms] Oracle (EN, ir, published 2025-10-14) https://www.oracle.com/news/announcement/ai-world-oracle-and-amd-expand-partnership-to-help-customers-achieve-next-generation-ai-scale-2025-10-14/: "Oracle, MI450 5만대 슈퍼클러스터를 공개 제공(2026 Q3 시작)."

### OpenAI (high)
- note: 6GW 규모 AI 인프라 계약(MI450, 2026 하반기부터).
- [confirms] 디일렉 (KO, news, published 2025-10-07) https://www.thelec.kr/news/articleView.html?idxno=41883: "AMD-오픈AI, 6GW 규모 GPU 공급 계약 체결."
- [confirms] 한국경제 (KO, news, published 2025-10-06) https://www.hankyung.com/article/202510067187i: "삼성 HBM 고객사 AMD가 오픈AI에 AI가속기 대량 공급키로."

### Microsoft (high)  → /microsoft.md
- note: Azure에서 MI300X로 Copilot 프로덕션 운영.
- [confirms] AMD (EN, ir, published 2025-06-12) https://ir.amd.com/news-events/press-releases/detail/1201/amd-accelerates-pace-of-data-center-ai-innovation-and-leadership-with-expanded-amd-instinct-gpu-roadmap: "Microsoft·Meta·OpenAI가 MI350 배포 약속."

### Meta (high)  → /meta.md
- note: Llama 3·4 추론에 MI300X 사용.
- [mentions] 데이터센터다이내믹스 (EN, news, published 2026-05-06) https://www.datacenterdynamics.com/en/news/amd-posts-q1-2026-data-center-revenue-of-58bn-forecasts-120bn-server-cpu-income-by-2030/: "FY26 1분기 데이터센터 매출 $5.8B(+57%), MI350·EPYC 수요가 견인."
- [confirms] AMD (EN, ir, published 2025-06-12) https://ir.amd.com/news-events/press-releases/detail/1201/amd-accelerates-pace-of-data-center-ai-innovation-and-leadership-with-expanded-amd-instinct-gpu-roadmap: "Meta가 MI300X를 Llama 추론에 활용."

## Money out · pays to (6)
### TSMC (high)  → /tsmc.md
- note: MI350 XCD를 TSMC N3P 공정에 위탁(파운드리).
- [confirms] SEC EDGAR (EN, filing, published 2026-02-04) https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm: "AMD 10-K: HPC·FPGA·적응형SoC 웨이퍼 생산에 TSMC 이용."
- [confirms] TrendForce (EN, news, published 2025-06-13) https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/: "MI350X/MI355X는 TSMC N3P 기반."

### 삼성전자 (high)  → /samsung-electronics.md
- note: MI350용 HBM3E 12단 공급사 + 일부 파운드리. 2025-06부터 공급.
- [confirms] 한국경제 (KO, news, published 2025-06-13) https://www.hankyung.com/article/202506133500i: "삼성전자가 AMD MI350에 HBM3E 12단 공급, 2025-06부터."
- [confirms] TrendForce (EN, news, published 2025-06-13) https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/: "MI350은 삼성·마이크론을 HBM3E 듀얼 공급사로 채택."

### Micron Technology (high)  → /micron.md
- note: MI350용 HBM3E 36GB 공급(삼성과 듀얼).
- [confirms] TrendForce (EN, news, published 2025-06-13) https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/: "MI350 288GB HBM3E는 마이크론·삼성 공급."
- [mentions] AMD (EN, ir, published 2025-06-12) https://ir.amd.com/news-events/press-releases/detail/1201/amd-accelerates-pace-of-data-center-ai-innovation-and-leadership-with-expanded-amd-instinct-gpu-roadmap: "MI350 시리즈 288GB HBM3E 탑재."

### GlobalFoundries (mid)
- note: 일부 제품 파운드리 위탁.
- [confirms] SEC EDGAR (EN, filing, published 2026-02-04) https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm: "AMD 10-K: GLOBALFOUNDRIES도 파운드리로 이용."

### 삼성전기 (mid)  → /samsung-electro-mechanics.md
- note: AI 가속기용 FC-BGA 반도체 기판 매입.
- [confirms] 디일렉 (KO, news, published 2026-01-31) https://www.thelec.kr/news/articleView.html?idxno=51302: "삼성전기가 NVIDIA·AMD·구글·아마존·애플에 이어 브로드컴까지 FC-BGA 고객으로 확보, AI 가속기 기판 공급."

### SK hynix (mid)  → /sk-hynix.md
- note: AI 가속기(MI300·MI350)용 HBM3E를 SK하이닉스에서 매입(공급사 중 하나).
- [mentions] Notebookcheck (EN, news, accessed 2026-06-19) https://www.notebookcheck.net/SK-hynix-sells-out-its-DRAM-NAND-and-HBM-chip-supply-to-Nvidia-through-2026-as-AI-demand-outpaces-Samsung-and-Micron-s-capacity.1151402.0.html: "NVIDIA·Google 등 글로벌 AI 고객 대상 HBM 공급."

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_Generated for LLM/agent consumption. Each edge lists stance (confirms/mentions/contradicts), source publisher, language, date, and excerpt for verification._