{"slug":"amd","name":"AMD","name_en":"AMD","ticker":"AMD","updated_at":"2026-06-20","canonical":"https://valuechain.wiki/amd","kicker":"AI 가속기 · CPU · 적응형SoC","kicker_en":"AI accelerators · CPU · Adaptive SoC","lead":"NVIDIA의 주요 경쟁자. FY2025 매출 $34.6B(+34%, 데이터센터 $16.6B), FY26 Q1 데이터센터 $5.8B(+57%)로 MI350 본격 램프. Instinct MI350(HBM3E 288GB)을 Microsoft·Meta·Oracle·OpenAI에 공급. 칩은 TSMC(N3P)·GlobalFoundries에 위탁, HBM은 삼성·마이크론에서 매입.","lead_en":"A key Nvidia rival. FY2025 revenue $34.6B (+34%, data center $16.6B); Q1 FY2026 data center $5.8B (+57%) as MI350 ramps. Supplies Instinct MI350 (288GB HBM3E) to Microsoft, Meta, Oracle and OpenAI. Chips at TSMC (N3P) and GlobalFoundries; HBM from Samsung and Micron.","segments":{"fy":2025,"parts":[{"desc":"Instinct AI 가속기·EPYC 서버 CPU","name":"데이터센터","share":"$16.6B"},{"desc":"Ryzen·Radeon","name":"클라이언트+게이밍","share":"$14.6B"},{"desc":"Xilinx FPGA·적응형SoC","name":"임베디드","share":"$3.5B"}],"total":"$34.6B (FY2025, +34%); FY26 Q1 매출 $10.3B(+38%), 데이터센터 $5.8B(+57%)","source":"https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm","concentration":"단일고객 10%↑ 없음(FY2025, 분산). 데이터센터 FY2025 $16.6B → FY26 Q1 $5.8B, Q2 가이던스 전사 $11.2B"},"segments_en":{"parts":[{"desc":"Instinct AI accelerators and EPYC server CPUs","name":"Data Center","share":"$16.6B"},{"desc":"Ryzen and Radeon","name":"Client + Gaming","share":"$14.6B"},{"desc":"Xilinx FPGA and adaptive SoC","name":"Embedded","share":"$3.5B"}],"total":"$34.6B (FY2025, +34%); Q1 FY2026 revenue $10.3B (+38%), data center $5.8B (+57%)","concentration":"No single customer ≥10% (FY2025, diversified). Data Center $16.6B"},"edges":[{"direction":"revenue","counterparty":"Oracle","counterparty_slug":null,"confidence":"high","metric":{"type":"unit_count","unit":"GPU","basis":"MI450 슈퍼클러스터","value":50000,"period":"2026","basis_en":"MI450 supercluster","qualifier":"planned"},"note":"MI450 5만대 슈퍼클러스터 제공(첫 하이퍼스케일러).","note_en":"First hyperscaler to offer a 50,000-GPU MI450 supercluster.","sources":[{"stance":"confirms","publisher":"Oracle","publisher_en":"Oracle","kind":"ir","lang":"en","published_at":"2025-10-14","url":"https://www.oracle.com/news/announcement/ai-world-oracle-and-amd-expand-partnership-to-help-customers-achieve-next-generation-ai-scale-2025-10-14/","title":"Oracle and AMD Expand Partnership","title_en":"Oracle and AMD Expand Partnership","excerpt":"Oracle, MI450 5만대 슈퍼클러스터를 공개 제공(2026 Q3 시작).","excerpt_en":"Oracle to offer a publicly available 50,000 MI450 supercluster (starting Q3 2026)."}]},{"direction":"revenue","counterparty":"OpenAI","counterparty_slug":null,"confidence":"high","metric":{"type":"contract_value","basis":"6GW AI 인프라","basis_en":"6GW AI infrastructure","qualifier":"capacity"},"note":"6GW 규모 AI 인프라 계약(MI450, 2026 하반기부터).","note_en":"6 gigawatt AI infrastructure deal (MI450, from 2H 2026).","sources":[{"stance":"confirms","publisher":"디일렉","publisher_en":"The Elec","kind":"news","lang":"ko","published_at":"2025-10-07","url":"https://www.thelec.kr/news/articleView.html?idxno=41883","title":"AMD-오픈AI, 6GW 규모 GPU 공급 체결","title_en":"AMD and OpenAI sign 6GW GPU supply deal","excerpt":"AMD-오픈AI, 6GW 규모 GPU 공급 계약 체결.","excerpt_en":"AMD and OpenAI signed a 6GW GPU supply deal."},{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2025-10-06","url":"https://www.hankyung.com/article/202510067187i","title":"삼성 HBM 고객사 美 AMD, 오픈AI에 AI가속기 대량 공급키로","title_en":"Samsung HBM customer AMD to supply AI accelerators to OpenAI in bulk","excerpt":"삼성 HBM 고객사 AMD가 오픈AI에 AI가속기 대량 공급키로.","excerpt_en":"Samsung HBM customer AMD will supply AI accelerators to OpenAI in bulk."}]},{"direction":"cost","counterparty":"TSMC","counterparty_slug":"tsmc","confidence":"high","metric":{"type":"supply_status","basis":"파운드리(N3P)","basis_en":"foundry (N3P)","qualifier":"confirmed_no_disclosed_value"},"note":"MI350 XCD를 TSMC N3P 공정에 위탁(파운드리).","note_en":"MI350 XCDs are made on TSMC's N3P node (foundry).","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-04","url":"https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm","title":"AMD Form 10-K (FY2025, 2025-12-27)","title_en":"AMD Form 10-K (FY2025, 2025-12-27)","excerpt":"AMD 10-K: HPC·FPGA·적응형SoC 웨이퍼 생산에 TSMC 이용.","excerpt_en":"AMD 10-K: utilizes TSMC for wafer production of HPC, FPGA and adaptive SoC products."},{"stance":"confirms","publisher":"TrendForce","publisher_en":"TrendForce","kind":"news","lang":"en","published_at":"2025-06-13","url":"https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/","title":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","title_en":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","excerpt":"MI350X/MI355X는 TSMC N3P 기반.","excerpt_en":"MI350X/MI355X are built on TSMC's N3P node."}]},{"direction":"cost","counterparty":"삼성전자","counterparty_slug":"samsung-electronics","confidence":"high","metric":{"type":"supply_status","basis":"HBM3E 12H + 파운드리","basis_en":"HBM3E 12-high + foundry","qualifier":"confirmed_no_disclosed_value"},"note":"MI350용 HBM3E 12단 공급사 + 일부 파운드리. 2025-06부터 공급.","note_en":"HBM3E 12-high supplier for MI350 plus some foundry. Supplying since June 2025.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2025-06-13","url":"https://www.hankyung.com/article/202506133500i","title":"삼성전자, AMD에 HBM3E 12단 공급… 엔비디아 납품 속도","title_en":"Samsung supplies 12-high HBM3E to AMD","excerpt":"삼성전자가 AMD MI350에 HBM3E 12단 공급, 2025-06부터.","excerpt_en":"Samsung supplies 12-high HBM3E to AMD's MI350 from June 2025."},{"stance":"confirms","publisher":"TrendForce","publisher_en":"TrendForce","kind":"news","lang":"en","published_at":"2025-06-13","url":"https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/","title":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","title_en":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","excerpt":"MI350은 삼성·마이크론을 HBM3E 듀얼 공급사로 채택.","excerpt_en":"MI350 uses Samsung and Micron as dual HBM3E suppliers."}]},{"direction":"cost","counterparty":"Micron Technology","counterparty_slug":"micron","confidence":"high","metric":{"type":"supply_status","basis":"HBM3E 36GB","basis_en":"HBM3E 36GB","qualifier":"confirmed_no_disclosed_value"},"note":"MI350용 HBM3E 36GB 공급(삼성과 듀얼).","note_en":"HBM3E 36GB supplier for MI350 (dual with Samsung).","sources":[{"stance":"confirms","publisher":"TrendForce","publisher_en":"TrendForce","kind":"news","lang":"en","published_at":"2025-06-13","url":"https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/","title":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","title_en":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","excerpt":"MI350 288GB HBM3E는 마이크론·삼성 공급.","excerpt_en":"MI350's 288GB HBM3E comes from Micron and Samsung."},{"stance":"mentions","publisher":"AMD","publisher_en":"AMD","kind":"ir","lang":"en","published_at":"2025-06-12","url":"https://ir.amd.com/news-events/press-releases/detail/1201/amd-accelerates-pace-of-data-center-ai-innovation-and-leadership-with-expanded-amd-instinct-gpu-roadmap","title":"AMD Expanded Instinct GPU Roadmap","title_en":"AMD Expanded Instinct GPU Roadmap","excerpt":"MI350 시리즈 288GB HBM3E 탑재.","excerpt_en":"MI350 series carries 288GB HBM3E."}]},{"direction":"revenue","counterparty":"Microsoft","counterparty_slug":"microsoft","confidence":"high","metric":null,"note":"Azure에서 MI300X로 Copilot 프로덕션 운영.","note_en":"Runs production Copilot workloads on MI300X in Azure.","sources":[{"stance":"confirms","publisher":"AMD","publisher_en":"AMD","kind":"ir","lang":"en","published_at":"2025-06-12","url":"https://ir.amd.com/news-events/press-releases/detail/1201/amd-accelerates-pace-of-data-center-ai-innovation-and-leadership-with-expanded-amd-instinct-gpu-roadmap","title":"AMD Expanded Instinct GPU Roadmap","title_en":"AMD Expanded Instinct GPU Roadmap","excerpt":"Microsoft·Meta·OpenAI가 MI350 배포 약속.","excerpt_en":"Microsoft, Meta and OpenAI committed to MI350 deployments."}]},{"direction":"revenue","counterparty":"Meta","counterparty_slug":"meta","confidence":"high","metric":null,"note":"Llama 3·4 추론에 MI300X 사용.","note_en":"Uses MI300X for Llama 3 and 4 inference.","sources":[{"stance":"mentions","publisher":"데이터센터다이내믹스","publisher_en":"Data Center Dynamics","kind":"news","lang":"en","published_at":"2026-05-06","url":"https://www.datacenterdynamics.com/en/news/amd-posts-q1-2026-data-center-revenue-of-58bn-forecasts-120bn-server-cpu-income-by-2030/","title":"AMD, FY26 1분기 데이터센터 매출 $5.8B","title_en":"AMD posts Q1 2026 data center revenue of $5.8bn","excerpt":"FY26 1분기 데이터센터 매출 $5.8B(+57%), MI350·EPYC 수요가 견인.","excerpt_en":"Q1 FY2026 data-center revenue $5.8B (+57%), driven by MI350 and EPYC demand."},{"stance":"confirms","publisher":"AMD","publisher_en":"AMD","kind":"ir","lang":"en","published_at":"2025-06-12","url":"https://ir.amd.com/news-events/press-releases/detail/1201/amd-accelerates-pace-of-data-center-ai-innovation-and-leadership-with-expanded-amd-instinct-gpu-roadmap","title":"AMD Expanded Instinct GPU Roadmap","title_en":"AMD Expanded Instinct GPU Roadmap","excerpt":"Meta가 MI300X를 Llama 추론에 활용.","excerpt_en":"Meta uses MI300X for Llama inference."}]},{"direction":"cost","counterparty":"GlobalFoundries","counterparty_slug":null,"confidence":"mid","metric":null,"note":"일부 제품 파운드리 위탁.","note_en":"Foundry for certain products.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-04","url":"https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm","title":"AMD Form 10-K (FY2025, 2025-12-27)","title_en":"AMD Form 10-K (FY2025, 2025-12-27)","excerpt":"AMD 10-K: GLOBALFOUNDRIES도 파운드리로 이용.","excerpt_en":"AMD 10-K: also utilizes GLOBALFOUNDRIES as a foundry."}]},{"direction":"cost","counterparty":"삼성전기","counterparty_slug":"samsung-electro-mechanics","confidence":"mid","metric":null,"note":"AI 가속기용 FC-BGA 반도체 기판 매입.","note_en":"Buys FC-BGA semiconductor substrates for AI accelerators.","sources":[{"stance":"confirms","publisher":"디일렉","publisher_en":"The Elec","kind":"news","lang":"ko","published_at":"2026-01-31","url":"https://www.thelec.kr/news/articleView.html?idxno=51302","title":"삼성전기, MLCC·AI 서버용 기판 수요 급증…\"올해도 수급 빡빡\"","title_en":"Samsung Electro-Mechanics: surging demand for MLCC and AI-server substrates","excerpt":"삼성전기가 NVIDIA·AMD·구글·아마존·애플에 이어 브로드컴까지 FC-BGA 고객으로 확보, AI 가속기 기판 공급.","excerpt_en":"Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."}]},{"direction":"cost","counterparty":"SK hynix","counterparty_slug":"sk-hynix","confidence":"mid","metric":null,"note":"AI 가속기(MI300·MI350)용 HBM3E를 SK하이닉스에서 매입(공급사 중 하나).","note_en":"Buys HBM3E for its AI accelerators (MI300/MI350) from SK hynix (one of its suppliers).","sources":[{"stance":"mentions","publisher":"Notebookcheck","publisher_en":null,"kind":"news","lang":"en","published_at":null,"url":"https://www.notebookcheck.net/SK-hynix-sells-out-its-DRAM-NAND-and-HBM-chip-supply-to-Nvidia-through-2026-as-AI-demand-outpaces-Samsung-and-Micron-s-capacity.1151402.0.html","title":"SK hynix sells out 2026 supply to Nvidia","title_en":null,"excerpt":"NVIDIA·Google 등 글로벌 AI 고객 대상 HBM 공급.","excerpt_en":"Supplies HBM to global AI customers such as NVIDIA and Google."}]}]}